Specifications

GW2A-18 Logic

20,736 LUT4 with 15,552 flip-flops

GW2A-55 Logic

54,720 LUT4 with 41,040 flip-flops

GW2AN-9X Logic

10,368 LUT4 with 10,368 flip-flops

GW2AN-18X Logic

20,736 LUT4 with 15,552 flip-flops

Block SRAM (GW2A-18)

828 Kbit in 46 BSRAM blocks

Block SRAM (GW2A-55)

2,520 Kbit in 140 BSRAM blocks

Shadow SRAM

40 Kbit on GW2A-18/GW2AN devices; 106 Kbit on GW2A-55/GW2AN-55

Integrated Flash

16 Mbit NOR flash on GW2AN-9X/18X; 32 Mbit on GW2AN-55 for configuration and user storage

Multipliers

48 x 18x18 multipliers on GW2A-18; 40 x 18x18 on GW2A-55

PLLs and Clocks

2 PLLs on GW2AN-9X/18X, 4 PLLs on GW2A-18, 6 PLLs on GW2A-55/GW2AN-55 with 8 global clocks

GPIO Capacity

Up to 389 GPIOs on GW2AN-9X/18X; up to 608 GPIOs on GW2A-55/GW2AN-55

Serialized Interfaces

MIPI CSI-2, MIPI DSI, LVDS, HDMI, USB 2.0, PCI and Ethernet support

Memory Interfaces

DDR3, HyperRAM and PSRAM support, including integrated PSRAM/DDR3 on Arora II extension devices

LVDS and MIPI Rates

LVDS up to 1250 Mbps and MIPI up to 1200 Mbps on GW2AN family devices

Core Voltage Options

1.0 V typical (LV), 1.2 V (EV) and 2.5 V/3.3 V (UV) core options on GW2AN devices

Package Range

QN88, EQ144, MG196, PG256 variants, PG484, PG1156, UG324 variants, UG484 and UG676 with 0.4 mm to 1.0 mm pitch

Smallest Footprint

Packages as small as 8 x 8 mm

Configuration and Security

JTAG, MSPI, SSPI, I2C and CPU configuration with multi-boot, bitstream encryption and device locking

Automotive Grade

AEC-100Q automotive-qualified GW2A-A devices

Family Variants

GW2A (traditional), GW2AN (integrated flash), GW2AR (integrated RAM), GW2ANR (flash plus RAM) and GW2A-A (automotive)

Overview

The GOWIN Arora II family delivers a best-in-class performance-to-cost ratio for mid-density programmable logic, making it a common choice for compute-intensive consumer, industrial, automotive and test-equipment designs. The devices combine optimized LUT4 logic with dedicated DSP blocks, BSRAM and serialized I/O for real-time SoC, co-processing and signal-processing development.

What separates Arora II from a conventional mid-range FPGA is the range of integrated options: GW2AN devices embed 16 Mbit to 32 Mbit of NOR flash for single-chip configuration and user storage, while GW2AR and GW2ANR variants integrate RAM and PSRAM/DDR3 support. That integration lets a design boot without an external configuration flash and keep more board area for sensors and I/O.

Arora II's serialized interface support — MIPI CSI-2 and DSI, LVDS, HDMI, PCI, Ethernet, DDR3, HyperRAM and PSRAM — makes it a workhorse for camera capture, display driving, industrial I/O expansion and bridging in edge-AI and machine-vision systems, with AEC-100Q qualified parts available for automotive platforms.

Key Benefits

Integrated flash and RAM options reduce external component count and enable single-chip boot. High I/O and RAM ratio relative to logic density suits sensor aggregation and real-time pipeline work. Broad package range from 8 x 8 mm to 35 x 35 mm lets one family scale from space-constrained modules to I/O-rich control boards. Automotive qualification (AEC-100Q) and bitstream encryption with device locking support production and anti-cloning requirements.

Applications

Industrial control and PLC co-processing, machine-vision camera capture and preprocessing, automotive camera and display systems, LED display control, test-and-measurement instruments, consumer imaging devices, and real-time signal-processing accelerators alongside a host processor.

Request a Quote — GOWIN ARORA II FPGA (GW2A / GW2AN / GW2AR / GW2ANR) — MID-DENSITY FPGA WITH INTEGRATED FLASH

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