Specifications

Family

Efinix Titanium Edge FPGAs, built on the proven Titanium architecture and Quantum fabric

Ti125

123,000 logic elements — sampling now

Ti125 SiP

123,000 logic elements with integrated 512Mb HyperRAM and SPI boot flash — sampling August 2026

Ti95

93,000 logic elements — sampling now

Ti70

68,000 logic elements — sampling Q4 2026

Ti70 SiP

68,000 logic elements with integrated 256Mb HyperRAM and SPI boot flash — sampling Q4 2026

Ti40

39,000 logic elements — sampling Q4 2026

Security Variants

Ti125 and Ti95 security variants planned for Q4 2026 sampling

Core Advantages

Breakthrough power reduction, System-in-Package integration and high-speed MIPI I/O

SEU Handling

Advanced SEU detection, correction and scrubbing for reliable operation

Security

Post-quantum cryptography support built into the family roadmap

Design Target

Constrained edge AI deployments where power and board area are the binding constraints

Development IDE

Efinity Integrated Development Environment — RTL to bitstream in a single toolchain

Embedded Processing

Sapphire SoC solutions for embedded processor and AI acceleration

Titanium Family Range

4K to 2 million logic elements across the wider Titanium portfolio

SiP Benefits

Reduce PCB complexity, accelerate prototyping and streamline production

Applications

Embedded vision, industrial automation, robotics, automotive systems, physical AI and edge computing

Announcement

Family launched 9 June 2026; device sampling schedule as listed per part

Overview

Efinix announced the Titanium Edge family on 9 June 2026 as a line of FPGAs purpose-built for constrained edge AI applications. Built on the company's Titanium architecture and Quantum fabric, the family targets the point where an application needs deterministic, low-latency programmable logic but cannot afford the power budget or board area of a conventional mid-range FPGA.

Six devices make up the launch range. The Ti125 offers 123,000 logic elements and is sampling now, alongside the Ti95 at 93,000 logic elements. SiP variants fold system components directly into the package: the Ti125 SiP integrates 512Mb of HyperRAM and SPI boot flash with the same 123,000 logic elements, and the Ti70 SiP pairs 68,000 logic elements with 256Mb HyperRAM and SPI boot flash. The Ti70 and Ti40 round out the low end at 68,000 and 39,000 logic elements respectively, with Q4 2026 sampling windows for the balance of the family and for Ti125/Ti95 security variants.

Three attributes distinguish the family from general-purpose low-density FPGAs. Power reduction is the headline claim, aimed squarely at always-on vision and sensing front ends. High-speed MIPI I/O makes the parts natural fits for camera interfaces. And reliability features matter for deployment rather than lab use: advanced SEU detection, correction and scrubbing protect configuration memory in radiation-sensitive or long-run environments, while post-quantum cryptography support is on the family roadmap. Design work happens in the Efinity IDE from RTL to bitstream, with Sapphire SoC providing embedded processor and AI acceleration options.

Key Benefits

Ultra-low static power makes always-on vision and sensing front ends practical where a conventional FPGA would blow the thermal budget. SiP variants integrate HyperRAM and boot flash, cutting PCB complexity and shortening prototype-to-production paths. High-speed MIPI I/O suits direct camera sensor attachment for embedded vision. SEU detection, correction and scrubbing plus post-quantum security options support long-lifecycle and security-conscious deployments. Scalable from 39K to 123K logic elements within one architecture, so a design can move up or down without changing toolchain.

Applications

Embedded vision and machine vision front ends; industrial automation and robotics control; automotive sensing and in-cabin systems; physical AI sensor preprocessing; edge computing where power and thermal budgets are tight; secure industrial designs with post-quantum requirements.

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