Specifications
Product Family
Eaton Coolant Distribution Units (CDU) for AI and enterprise data centers
Top-of-Range Model
ROL4000-48U65 — 2000 kW at 3 °C approach temperature
ROL4000 Design Basis
Inspired by OCP Project Deschutes 5th-generation CDU specifications
ROL4000 Flow
500 GPM (1890 LPM) at up to 80 PSI available pressure
ROL4000 Filtration
0.2-micron side-stream filtration
ROL4000 Redundancy
Seal-less N+1 pumps with fully redundant power feeds per pump circuit
ROL2300-48U40
1150 kW at 4 °C approach / 2300 kW at 8 °C, 400 GPM at 55 psi
ROL1100-48U32
1100 kW at 8 °C approach / 550 kW at 4 °C, 125 GPM at 30 psi
RAL110-04U19
4U rack-level liquid-to-liquid CDU, up to 110 kW at 12 °C approach (50 kW at 6 °C), 24 GPM at 10 psi
RAA32-10U21
10U rack-level liquid-to-air CDU, 32 kW at 24 °C / 16 kW at 12 °C, 16 GPM at 12 psi
RAA22-10U19
10U rack-level liquid-to-air CDU, 22 kW at 24 °C, up to 50 LPM
Dimensions (ROL4000)
1651 x 1199 x 2364 mm
Dimensions (ROL2300)
1016 x 1219 x 2134 mm
Dimensions (ROL1100)
800 x 1205 x 2147 mm
Coolant
Deionized water or water-glycol mix in a secondary TCS loop
Dew-Point Control
The CDU controller continuously monitors temperature, pressure and flow rate, keeping coolant above the dew point so condensation cannot form on IT equipment
Loop Architecture
Primary facility water loop exchanges heat with the secondary technology cooling system (TCS) loop through an internal heat exchanger
Design Standard
Designed to meet IEC 62368-1 and tested to withstand 3x maximum working pressure
Reliability Testing
Thermal cycling, min/max storage and packaging testing to destruction on subcomponents
Rack Density Supported
L2L CDUs support 50 kW to 200+ kW per rack, as required by NVIDIA H100/H200 and AMD MI300X GPU clusters
Overview
An Eaton CDU sits between the facility water supply and the cold plates on the GPUs and CPUs. A pump circulates deionised water or a water-glycol mix through the direct-to-chip loop; the heat it picks up is transferred to the facility supply through a heat exchanger inside the CDU. The controller monitors temperature, pressure and flow continuously and keeps the coolant above the dew point, which is what prevents condensation forming on live IT equipment.
The row-level family is where the AI capacity sits. The ROL4000-48U65 reaches 2000 kW at a 3 °C approach temperature with 500 GPM of flow, and is built to the OCP Project Deschutes 5th-generation CDU specification, including seal-less N+1 pumps, redundant power feeds per pump circuit and 0.2-micron side-stream filtration. The ROL2300-48U40 covers up to 2.3 MW and the ROL1100-48U32 spans 550 kW to 1100 kW, both using facility water in-row.
For racks where facility water is unavailable, the liquid-to-air models do the same job against the room's air conditioning. The RAL110-04U19 is a 4U liquid-to-liquid unit up to 110 kW; the RAA32-10U21 and RAA22-10U19 are 10U liquid-to-air units at 32 kW and 22 kW. This is the practical path for retrofitting an existing air-cooled hall, cooling an edge site, or handling a high-power rack in a colocation cage with no chilled-water connection.
Key Benefits
Up to 2 MW of row-level cooling in the ROL4000 built to OCP Project Deschutes 5th-gen spec, N+1 seal-less pumps with redundant power feeds, 0.2-micron filtration and continuous dew-point control. Rack-level L2L and L2A units cover 22–110 kW, including sites with no facility water.
Applications
Direct-to-chip cooling of NVIDIA H100/H200 and AMD MI300X-class GPU clusters, retrofit of existing air-cooled halls via liquid-to-air CDUs, edge and colocation sites without chilled water, high-density AI rows at 50–200+ kW per rack, and any deployment where condensation risk on live IT equipment must be engineered out.
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