Specifications
Product
LiquidStack CDU-1MW universal coolant distribution unit (CDU)
Cooling Capacity
Up to 1,350 kW (1 MW class) of direct-to-chip cooling at a 13°C TCS delta-T and 4°C approach
Capacity by Delta-T
1,004 kW at 10°C delta-T; 1,202 kW at 12°C delta-T; 1,350 kW at 13°C delta-T
Maximum Flow Rate
1,500 litres per minute on the technology cooling system (TCS) loop
Glycol Rating
PG 25 propylene glycol
Heat Dissipation Ratio
1.15 lpm/kW at 13°C delta-T (1.25 lpm/kW at 12°C, 1.50 lpm/kW at 10°C)
Design Philosophy
Elevated operating water temperatures, narrow approach temperatures and higher differential pressure operation
Pumps
Dual hot-swappable variable-speed-drive (VSD) pumps
Heat Exchanger
316 stainless steel plate heat exchanger
Electrical
Integrated automatic transfer switch (ATS) with controller supercapacitor
Control Valve
2-way electronic pressure-independent control valve (E-PICV) or 3-way control valve
Filtration
Dual 25-micron filtration on the coolant loop
Dimensions
Row-style form factor: 900 mm wide x 1,242 mm deep x 2,200 mm high (35 in x 49 in x 87 in)
Weight
911 kg dry / 1,165 kg operating / 1,100 kg shipping (2,004 / 2,563 / 2,420 lb)
Facility Water Temperature
10°C to 45°C (50°F to 113°F) facility water supply range
Power Input
380-480 VAC, 50/60 Hz, 3-phase with neutral and earth; MOP 70 A, MCA 62.5 A, FLA 47 A
Power Consumption
23 kW total, approximately 11 kW per pump
Coolant Volume
78.92 L (20.85 gal) TCS loop and 119.24 L (31.50 gal) facility loop
Noise
Under 68 dBA at 3 m at full load
Protocols
MODBUS TCP/IP, RESTful API, BACnet IP and SNMP
Control Interface
7″ colour display with live P&ID view; temperature, pressure and flow sensors across TCS and facility loops
Features
Environmental monitoring with dew point control, PN16 static pressure rating, unit grouping of setpoints, rotation schedules and duty cycles
Efficiency Outcomes
36% reduction in energy used for cooling, 48% CAPEX reduction versus air cooling, 62% reduction in data center white space, 25% TCO improvement over 20 years
Certification
ETL listed with CE and CSA certification; top or bottom piping and electrical entry with optional floorstand
Options
N+1 component upgrade (expansion tanks, sensors), remote firmware upgrade, rope-type leak sensor and pump dry-run protection
Overview
The LiquidStack CDU-1MW is a row-form-factor coolant distribution unit aimed squarely at the thermal envelope of current AI chips and servers. A single unit delivers up to 1,350 kW of direct-to-chip cooling — 1,004 kW at a 10°C loop delta-T, 1,202 kW at 12°C and the full 1,350 kW at 13°C with a 4°C approach temperature — while moving up to 1,500 litres per minute of PG25 glycol.
The design is built around elevated operating water temperatures and narrow approach temperatures, which is what makes it suitable for both new AI data halls and retrofit facilities: warm facility water lets the heat rejection path avoid chillers, and the unit is right-sized for a data hall rather than a single rack. Hardware resilience includes dual hot-swappable VSD pumps, a 316 stainless steel plate heat exchanger, an integrated automatic transfer switch with controller supercapacitor, a 2-way electronic pressure-independent control valve and dual 25-micron filtration.
LiquidStack reports a 36% reduction in cooling energy, a 48% CAPEX reduction against air cooling, a 62% reduction in white space and a 25% improvement in 20-year TCO. Management is handled through MODBUS TCP/IP, RESTful API, BACnet IP and SNMP with a 7-inch colour display showing a live P&ID view, plus dew point control and full temperature, pressure and flow instrumentation across both loops.
Key Benefits
Megawatt-class distribution in one unit: up to 1,350 kW replaces several smaller CDUs, reducing piping, footprint and control complexity per data hall. Retrofit-friendly thermodynamics: high entering water temperatures and narrow approach temperatures let existing facilities host direct-to-chip loads without new chiller plant. Serviceable without downtime: dual hot-swappable VSD pumps, a controller supercapacitor holding the ATS through transfers, and rack-free row placement keep maintenance out of the critical path.
Applications
Direct-to-chip liquid cooling for Gen AI, large language model and HPC clusters, new-build AI data halls, retrofit of air-cooled halls with high-density racks, colocation white space reclamation, and CDU capacity expansion where supply is constrained.
Request a Quote — LIQUIDSTACK CDU-1MW COOLANT DISTRIBUTION UNIT — 1,350 KW DIRECT-TO-CHIP, 36% LESS COOLING ENERGY
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