Specifications
Product
Vertiv CoolChip CDU 2300
Family Capacity Range
70 kW to 2,300 kW (2.3 MW)
Cooling Types
Liquid-to-liquid and liquid-to-air heat exchange
Applications
Direct-to-chip cold plates and rear-door heat exchangers
Deployment Options
In-rack, in-row, and perimeter-based designs
Facility Water
Models with and without facility water access
Controller
Integrated — adapts temperature and flow to workload demand
Redundancy
Configurable N+1 style redundancy
Communications
Unit-to-unit communication and remote monitoring
Companion Hardware
CoolChip Fluid Network Row Manifolds (flushed, passivated, pressure-tested, sealed)
Manifold Compatibility
Direct-to-chip, rear-door heat exchange, and heat rejection circuits
Announced
EMEA expansion 2026 — showcased at Datacloud Global Congress
Overview
The Vertiv CoolChip CDU 2300 is a 2.3 MW coolant distribution unit, the largest point in the CoolChip CDU range that runs from 70 kW to 2.3 MW. It sits between the facility's heat-rejection loop and the server-level cold plates (or rear-door heat exchangers), moving coolant at controlled temperature and flow.
The design point is the modern AI rack. A single GB200 NVL72-class rack rejects well over 100 kW, and a row of them crosses the megawatt line - which is where a 2.3 MW unit replaces several smaller CDUs and the associated manifold, pump and control complexity. The family also includes liquid-to-air models that reject heat directly to ambient, for brownfield and colocation sites where modifying the building's water infrastructure is not practical.
Vertiv's integrated controller adapts coolant temperature and flow to workload demand rather than running at fixed setpoints, and supports unit-to-unit communication plus remote monitoring so a row of CDUs behaves as one system. The companion CoolChip Fluid Network Row Manifolds are supplied flushed, passivated, pressure-tested and sealed - the cleanliness step that protects cold-plate microchannels from the debris and corrosion that shorten loop life.
Key Benefits
2.3 MW capacity — one unit serves a full row of high-density AI racks. Liquid-to-liquid or liquid-to-air — deploys with or without facility water. Adaptive integrated controller — temperature and flow follow workload demand. Row manifold ecosystem — factory-flushed, passivated and pressure-tested distribution hardware.
Applications
Direct-to-chip liquid-cooled AI training racks, rear-door heat exchanger retrofits, high-density HPC clusters, colocation and brownfield sites without facility water, and megawatt-scale new-build AI data centres.
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