Specifications
Models
RAA22-10U19 and RAA32-10U21
Type
In-rack, liquid-to-air (no facility water required)
Cooling capacity
22 kW (RAA22) and 32 kW (RAA32) at 24 deg C approach
Secondary (TCS) fluid temperature range
25-50 deg C
Secondary flow rate
Up to 50 LPM (13.2 GPM) and up to 70 LPM (18.4 GPM)
Secondary fluid
Water, EGW or PGW
Environmental range
5-45 deg C
Connectors
1.5 inch tri-clamps
Form factor
19-inch rack mount, 10U
Deployment
Facility locations without access to a water loop
Application class
Edge AI and small HPC racks in air-cooled halls
Overview
The Boyd RAA series is the liquid-to-air member of the in-rack CDU family: it rejects the secondary-loop heat to room air instead of a facility water supply, so it can be deployed in facilities that have no water loop at all. The RAA22-10U19 is rated 22 kW and the RAA32-10U21 32 kW, both at a 24 deg C approach temperature.
The secondary technology-cooling loop runs between 25 and 50 deg C and moves up to 50 LPM (RAA22) or 70 LPM (RAA32), with 1.5 inch tri-clamp connections and water, EGW or PGW chemistry. At 10U the unit fits in a standard 19-inch rack alongside the compute it serves, making it the practical route to liquid cooling for edge AI racks and small HPC nodes in existing air-cooled halls.
Key Benefits
No facility water required - the RAA rejects heat straight to room air. 22-32 kW in 10U fits a standard rack. 25-50 deg C secondary loop accepts warm-water systems. 1.5 inch tri-clamp connections standardise plumbing.
Applications
Liquid-cooled edge AI racks in air-cooled halls, small HPC clusters, factory-floor inference nodes, and phased conversions where a facility water loop is not yet available.
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