Specifications
Model
Boyd ROL1100-48U32
Type
In-row, liquid-to-liquid (facility water to secondary loop)
Cooling capacity
550 kW at 4 deg C approach; 1,100 kW at 8 deg C approach
Secondary flow rate
125 GPM at 30 psi (473 LPM at 2.06 bar)
Secondary fluid
25% propylene glycol water (PGW); EGW and water compatible
Form factor
48U in-row cabinet
Pump / filter redundancy
N+1 hot-swappable pumps and filters
Monitoring and control
Modbus and BACnet; optional ATS transfer for backup power
Service access
Compact French-door front access
Scalability
Multiple units combined in software for 2N / N+1 plant redundancy
Rack density
One CDU can cool more than 10 NVIDIA NVL72-class racks
Application class
Hyperscale, colocation and enterprise AI data halls
Overview
The Boyd ROL1100 is an in-row coolant distribution unit that sits between the facility water loop and the secondary technology-cooling loop, delivering liquid-to-liquid heat rejection for high-density AI racks. Its rated capacity is 550 kW at a 4 deg C approach temperature and 1,100 kW at 8 deg C approach, moving 125 GPM (473 LPM) of secondary fluid at 30 psi (2.06 bar).
The unit is built as a 48U in-row cabinet with N+1 hot-swappable pumps and filters so a pump or filter can be changed without taking the loop down. Modbus and BACnet interfaces expose flow, pressure, temperature and alarm data to the DCIM, and an optional automatic transfer switch keeps the pumps running through a utility interruption. Boyd sizes the ROL1100 so a single CDU can serve more than ten NVIDIA NVL72-class racks; multiple units can be staged and combined in software to build the redundancy level the site requires.
Key Benefits
550-1,100 kW liquid-to-liquid capacity in one in-row cabinet matches a full AI rack cluster. N+1 hot-swappable pumps and filters keep the secondary loop live through service. Modbus and BACnet put loop telemetry straight into the DCIM. Optional ATS rides through utility interruptions without losing pump flow.
Applications
AI training and inference halls, colocation liquid-cooling plants, high-density enterprise data centers, and retrofit of air-cooled halls where rack power has passed the practical air-cooling limit.
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