Specifications
Product
Airsys UniCool-Max
Announced
16 April 2026
Type
Precision vertical packaged cooling unit
Function
High-density data center thermal management
Positioning
Redefines high-density cooling within the Airsys portfolio
Target
AI and high-performing digital infrastructure
Form Factor
Vertical packaged unit
Vendor
Airsys
Companion Platform
Airsys LiquidRack rack-level liquid cooling
Overview
UniCool-Max is Airsys' precision vertical packaged cooling unit, announced on 16 April 2026 as the company's answer to rising rack densities. Airsys frames it as redefining high-density cooling within its mission-critical portfolio, which spans data center, AI and other high-performing digital infrastructure.
Precision vertical packaged units sit in the room-level tier of the thermal stack: they are deployed alongside, rather than inside, the rack, and they complement rack-level liquid cooling platforms such as Airsys' own LiquidRack for sites that need both room conditioning and direct-to-chip fluid handling.
Key Benefits
Precision vertical packaged form factor for high-density halls, part of a complete Airsys thermal portfolio, and complementary to rack-level liquid cooling for mixed-density sites.
Applications
High-density data halls, AI training rooms, colocation facilities, and reinforcement of room-level cooling ahead of liquid-cooling retrofit.
Request a Quote — AIRSYS UNICOOL-MAX — PRECISION VERTICAL PACKAGED COOLING UNIT
QS Compute — global B2B supply of AI computing hardware, edge AI systems and accelerators. Volume pricing, 15-day sample lead time.
Get Your Quote →