Specifications
Product
Airsys LiquidRack (next generation)
Announced
20 April 2026
Type
Rack-level liquid cooling platform
Function
Localised fluid distribution, pumping and thermal management at the rack
Design Goal
Reduce reliance on centralised cooling support infrastructure
Target Deployments
Retrofit, edge and mid-density AI infrastructure
Markets
Data center, telecom and edge environments
Architecture
In-rack pumping and manifolds to the IT loop
Availability
Pilot deployment programme open at announcement
Vendor
Airsys
Overview
LiquidRack is Airsys' rack-level liquid cooling platform, relaunched in a next generation on 20 April 2026. Instead of routing every rack back to a centralised facility cooling plant, it localises fluid distribution, pumping and thermal management inside the rack — which is what makes it applicable to retrofit, edge and mid-density AI sites where a central CDU plant does not exist.
That positioning matters for edge AI deployments in particular: a telco or industrial site rarely has a large chiller loop, so a self-contained rack-level cooling unit removes the main barrier to putting high-density compute there. Airsys opened a pilot deployment programme at launch.
Key Benefits
Rack-localised pumping and fluid distribution, retrofit-friendly for existing halls, no central CDU plant required for edge sites, and targeted at mid-density AI where air cooling runs out.
Applications
Edge AI sites, telecom central offices, retrofit of mid-density data halls, and industrial on-premise AI compute where no facility cooling loop exists.
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