Specifications
Part Numbers
668348 (Intel Xeon mounting) · 668359 (AMD Rome SP3 mounting)
Product Type
Liquid cold plate for CPU / GPU packages
Cooling Method
Liquid cooling with low thermal resistance
Mounting Frame
Aluminium, designed for high mounting force without board flex
Hardware
Pre-assembled Intel Xeon or AMD SP3 compatible hardware
Thermal Interface
Pre-applied thermal grease for fast installation
Internal Design
Increased internal surface area for higher heat transfer
Application Class
CPU and GPU direct-to-chip liquid loops
Servicing
Field-replaceable / upgradeable cold plate assembly
Companion Products
Boyd CDUs, liquid manifolds, AI server cold plate assemblies
Custom Options
Customisable geometry for dense rack layouts and AI accelerators
Integration
Mates with liquid cooling loops, CDUs and manifolds
Manufacturer
Boyd Corporation
Design Benefit
Removes heat at source without increasing rack footprint
Reliability
Redundant-loop compatible; designed for continuous duty
Documentation
Boyd standard CPU liquid cold plate datasheets
Lifecycle
Active production
Overview
Boyd's liquid cold plates are the direct-to-chip building block of a liquid cooling loop: a machined plate that mounts on top of a CPU or GPU package and transfers heat into flowing coolant with low thermal resistance, replacing the air heat sink entirely. Two standard parts are catalogued for the common server sockets — 668348 for Intel Xeon and 668359 for AMD Rome SP3 — both supplied pre-assembled with the socket-compatible mounting hardware and pre-applied thermal grease.
The mechanical detail that matters in a server is the mounting frame: it is aluminium and designed to sustain high mounting forces while keeping the PCB flat, which is the failure mode that makes naive cold-plate retrofits crack boards or lose contact pressure over thermal cycles. The internal geometry adds surface area specifically to raise heat transfer, and because the plate is a drop-in replacement for the air heat sink, a server can be offered in air and liquid variants from the same base SKU.
Beyond the two standard CPU parts, Boyd builds cold plate assemblies for AI accelerators, memory modules and dense multi-GPU trays, and supplies the companion CDUs and liquid manifolds that the plates connect into. For a liquid-cooled deployment, choosing a cold plate family that has a matched CDU and manifold line is what keeps the loop balanced — mismatched flow resistances across a tray are the usual cause of one GPU running hot while the CDU looks lightly loaded.
Key Benefits
Drop-in replacement for air heat sinks — no server re-design needed to move to liquid. Pre-applied thermal grease and pre-assembled hardware shorten installation to a bolt-down. Aluminium mounting frame handles high mounting force without board flex. Low thermal resistance with enlarged internal surface area for high-TDP parts. Matched CDU and manifold line from the same vendor keeps loop hydraulics balanced. Customisable geometry for non-standard accelerator footprints.
Applications
CPU and GPU direct-to-chip cooling loops; AI and HPC server trays; liquid-cooling retrofits of existing air-cooled racks; high-TDP accelerator boards; memory and VRM cold plate assemblies; edge and ruggedised liquid-cooled enclosures; lab and test benches for thermal characterisation.
Request a Quote — BOYD LIQUID COLD PLATES 668348 / 668359 — CPU AND GPU DIRECT-TO-CHIP COOLERS
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