Specifications
Part Number
Verdin iMX95
CPU Name
NXP i.MX 95
CPU Type
Up to 6x Arm Cortex-A55
Microcontrollers
1x Arm Cortex-M7 and 1x Arm Cortex-M33
CPU Clock
1.8 GHz (A55), 800 MHz (M7), 333 MHz (M33)
RAM
Up to 16 GB LPDDR4x, 32-bit, with inline ECC
Flash
Up to 128 GB eMMC
Module Standard
Toradex Verdin
Target Applications
AI/ML edge workloads, industrial automation, robotics, avionics, defence, medical, UI/UX HMI, smart IoT
Software
Production-ready OS with configuration hardening and hardware-backed security
Configurability
CPU, memory, storage, connectivity and multimedia integrated on-module
Overview
The Toradex Verdin iMX95 brings NXP's i.MX 95 processor to the Verdin module standard, which Toradex positions for mission-critical and high-performance edge applications. It integrates CPU, memory, storage, connectivity and multimedia on the module so carrier design effort stays focused on application-specific I/O.
The compute configuration is up to six Cortex-A55 cores at 1.8 GHz, supported by an 800 MHz Cortex-M7 and a 333 MHz Cortex-M33 - the same three-domain arrangement used across i.MX 95 designs, giving Linux plus hard real-time plus a safety-capable core in one package.
Memory is the differentiator for regulated markets: up to 16 GB of 32-bit LPDDR4x with inline ECC, paired with up to 128 GB of eMMC. Inline ECC protects against single-bit memory errors in the field, which is a common requirement in medical, avionics and defence programmes where a silent DRAM fault is not an acceptable failure mode.
Key Benefits
Inline ECC memory: 16 GB of ECC-protected LPDDR4x suits medical, avionics and defence programmes that cannot tolerate silent memory faults. Three compute domains: A55 application cores plus M7 and M33 real-time cores cover Linux, deterministic control and safety in one module. Verdin ecosystem: the same pin-compatible standard covers the rest of the Toradex family, so a design can scale across performance tiers.
Applications
Industrial automation and motion control, robotics, avionics and defence systems, medical equipment, advanced HMI and touch interfaces, and AI/ML workloads at the edge of the industrial network.
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