Specifications
Module Families
Toradex OSM (OSM iMX91 / OSM iMX93) and Toradex Lino
Footprint
30 x 30 mm for both families
OSM Standard
Complies with OSM Size-S and attaches through a 332-ball contact grid soldered to the carrier
Lino Format
Proprietary format keeping OSM Size-S dimensions but using two board-to-board connectors for upgradeability
SoC Option 1
NXP i.MX 93 with 2x Cortex-A55 at 1.7 GHz and 2x Cortex-M33 at 250 MHz
i.MX 93 GPU
PXP 2D GPU with blending/composition, resize and colour space conversion
i.MX 93 NPU
Arm Ethos-U65 NPU at 1 GHz delivering up to 0.5 TOPS
SoC Option 2
NXP i.MX 91 with a single Arm Cortex-A55 core at 1.4 GHz
Security
NXP EdgeLock Secure Enclave on both variants
System Memory
Up to 2GB LPDDR4 with inline ECC
Storage
Up to 256GB eMMC flash plus 2x SDIO/SD/MMC interfaces
Display
4-lane MIPI DSI output on i.MX 93 variants only
Camera
2-lane MIPI CSI-2 input on i.MX 93 variants only
Networking
2x RGMII Ethernet, one with time-sensitive networking
USB
USB 2.0 OTG and USB 2.0 host
Low-Speed I/O
3x I2C, 2x I3C, 2x SPI, 4x UART, 3x PWM, 2x CAN FD and 10x GPIO
Analog
4x analog inputs via ADC
Temperature Range
-40 to +85C industrial operating range
Shock and Vibration
EN 60068-2-6 compliant with 50g 20ms shock rating
Operating Systems
Torizon Linux and Yocto Project by default, plus FreeRTOS, Zephyr OS and QNX support
Overview
Toradex has separated the two decisions that usually complicate SoM selection: which processor to use, and whether the module should be soldered down or socketed. The OSM family follows the open OSM Size-S standard and attaches through a 332-ball contact grid soldered directly to the carrier, giving the lowest profile and best thermal path. The Lino family keeps the identical 30 x 30 mm dimensions but replaces the solder grid with two board-to-board connectors, so a unit in the field can be upgraded or replaced by swapping the module.
Both families are offered with NXP i.MX 93 or i.MX 91 silicon. The i.MX 93 variants carry two Cortex-A55 cores at 1.7 GHz, a dual Cortex-M33 real-time complex at 250 MHz, a PXP 2D GPU and an Arm Ethos-U65 NPU rated 0.5 TOPS - enough for presence detection, simple classification and vision pre-processing at the edge. The i.MX 91 variants drop to a single Cortex-A55 at 1.4 GHz for cost-driven designs, and EdgeLock Secure Enclave is present across the range.
The industrial envelope is explicit: -40 to +85C operation, EN 60068-2-6 shock and vibration compliance with a 50g 20ms rating, inline ECC LPDDR4 up to 2GB, up to 256GB eMMC and dual RGMII Ethernet with TSN on one port. Toradex supports Torizon Linux and Yocto by default, with FreeRTOS, Zephyr and QNX available - a software spread that suits both Linux HMI products and hard real-time control designs.
Key Benefits
Solder-down OSM or connectorised Lino in the same 30 x 30 mm footprint, 0.5 TOPS Ethos-U65 NPU with EdgeLock Secure Enclave, inline ECC LPDDR4, and -40 to +85C with 50g shock qualification.
Applications
Industrial HMI and control panels, medical and laboratory instruments, transportation and railway subsystems, building automation controllers, and connected edge devices requiring a field-replaceable compute module.
Request a Quote — TORADEX OSM AND LINO SOMS — 30X30 MM NXP I.MX 93 AND I.MX 91 MODULES WITH SOLDER-DOWN OR B2B OPTIONS
QS Compute — global B2B supply of AI computing hardware, edge AI systems and accelerators. Volume pricing, 15-day sample lead time.
Get Your Quote →