Specifications
Form Factor
LGA system-on-module, 30 x 30 mm, 303 pads
SoC
MediaTek Genio 360P (MT8367); hexa-core Genio 360 (MT8366) variant
CPU
2x Arm Cortex-A76 + 6x Arm Cortex-A55 (up to 2.0 GHz commercial / 1.9 GHz industrial)
GPU
Arm Mali-G57 MC2 @ up to 700 MHz
GPU APIs
OpenGL ES 3.2, Vulkan 1.1, OpenCL 2.0
AI Accelerator
MediaTek 8th-Gen NPU, 1x MDLA5.3, GenAI up to 7.4 TOPS
Video Decode
H.264 / H.265 / VP9 up to 4Kp30
Video Encode
H.264 / H.265 up to 1080p90
JPEG
Decode 250 MP/s, encode 400 MP/s
System Memory
Up to 8 GB LPDDR4x
Storage
Up to 64 GB eMMC flash
Display Interfaces
MIPI DSI, LVDS, eDP / DisplayPort
Camera Interfaces
MIPI CSI
Networking
Gigabit Ethernet
USB
USB 3.2 and USB 2.0
PCIe
PCIe Gen2
Fieldbus
CAN FD
PMIC
PMIC integrated on-module
OS Support
Linux (Yocto) and Android
Overview
The Grinn GenioSOM-360 is the first system-on-module built on the MediaTek Genio 360P octa-core SoC, packaging a 2x Cortex-A76 + 6x Cortex-A55 CPU cluster, Mali-G57 MC2 GPU and MediaTek's 8th-generation NPU into a 30 x 30 mm LGA module with 303 pads. The NPU delivers up to 7.4 TOPS for generative and vision AI workloads, with a hexa-core Genio 360 (MT8366) variant also available.
The module integrates up to 8 GB of LPDDR4x memory, up to 64 GB of eMMC flash and its own PMIC, keeping carrier-board design compact. All platform interfaces are exposed through the LGA pad array: MIPI DSI, LVDS and eDP/DP display, MIPI CSI camera, Gigabit Ethernet, USB 3.2 and USB 2.0, PCIe Gen2 and CAN FD for industrial fieldbus connectivity.
With a 30 x 30 mm footprint and industrial temperature options, the GenioSOM-360 targets space-constrained edge AI products - smart cameras, HMI panels, robotics controllers and industrial IoT gateways. Grinn supports the module with Yocto Linux and Android BSPs plus an EVB carrier. QS Compute supplies and quotes the Grinn GenioSOM-360 family.
Key Benefits
['First SoM on MediaTek Genio 360P with 7.4 TOPS GenAI NPU', '30 x 30 mm LGA footprint for space-constrained designs', 'On-module LPDDR4x, eMMC and PMIC simplify carrier hardware', 'MIPI DSI, LVDS, eDP/DP, CSI, PCIe Gen2 and CAN FD all exposed', 'Industrial and commercial temperature options with Yocto Linux and Android']
Applications
['Compact edge AI cameras and vision sensors', 'Industrial HMI and smart panel products', 'Robotics and motion-control controllers', 'Industrial IoT gateways with CAN FD', 'Retail and building-automation devices']
Request a Quote — GRINN GENIOSOM-360 — MEDIATEK GENIO 360/360P LGA SYSTEM-ON-MODULE
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