Specifications
Form Factor
COM Express 3.1 Type 6 Compact module
Processor
AMD Ryzen AI Embedded P100 Series (Zen 5)
Architecture
Zen 5 CPU cores with RDNA 3.5 graphics and XDNA 2 NPU
Combined AI Performance
Up to 59 TOPS
NPU Performance
Up to 50 TOPS (XDNA 2)
CPU Variants
4-core and 6-core options
Configurable TDP
15W to 54W, supporting passive and active cooling
Memory
Up to 96GB DDR5-5600
Displays
Up to four independent displays
Expansion
PCIe Gen4 and PEG x4
Networking
2.5 Gigabit Ethernet
USB
USB 3.2 Gen 2 and USB 2.0
Storage
SATA and optional onboard NVMe
Security / Firmware
TPM 2.0, UEFI firmware, hardware monitoring
Temperature Range
Commercial and industrial variants, down to -40C
Operating Systems
Windows 11, Windows 11 IoT Enterprise, Linux
Ecosystem
aReady.COM pre-configuration with ctrlX OS or Ubuntu Pro
Virtualisation
RTS Hypervisor for consolidating real-time control with GUI and AI workloads
Evaluation Carrier
conga-TEVAL COMe 3.0 exposes all COM Express signals
Pricing
Quote
Stock
Available
Overview
The congatec conga-TCRP1 is a COM Express 3.1 Type 6 Compact module built on the AMD Ryzen AI Embedded P100 Series of processors. It combines Zen 5 CPU cores with RDNA 3.5 graphics and an XDNA 2 NPU to reach 59 TOPS of combined AI performance, of which up to 50 TOPS comes from the NPU alone — a substantial step up from the previous Ryzen Embedded 8000 generation, which was limited to 16 TOPS.
The module supports up to 96GB of DDR5-5600 memory and is offered in 4-core and 6-core variants with a configurable 15W to 54W TDP. That range is what makes the part interesting for sealed, passively cooled designs: at the low end the module can be integrated into fanless industrial enclosures where a conventional desktop-class SoC would not fit thermally.
I/O covers up to four independent displays, PCIe Gen4 and PEG x4 expansion, 2.5 Gigabit Ethernet, USB 3.2 Gen 2 and USB 2.0, and SATA or optional onboard NVMe storage. TPM 2.0, UEFI firmware and hardware monitoring are included, and the module ships in both commercial and industrial variants with operating temperatures down to -40C.
Software support spans Windows 11, Windows 11 IoT Enterprise and Linux. As part of congatec's aReady.COM ecosystem the module can be pre-configured with ctrlX OS or Ubuntu Pro, and supports the RTS Hypervisor to consolidate real-time control and GUI/AI workloads on a single board. congatec also offers the conga-TEVAL COMe 3.0 evaluation carrier, which exposes all COM Express signals including six PCIe x1 slots, PCIe x16 PEG, ExpressCard, mini PCIe, Gigabit Ethernet, USB 2.0/3.0, SATA, dual HDMI, dual DisplayPort, LVDS and legacy I/O for bring-up and validation.
Key Benefits
50 TOPS XDNA 2 NPU on a COM Express module — roughly triple the previous generation's 16 TOPS. 15W-to-54W configurable TDP enables fully passive, sealed industrial enclosures. Up to 96GB DDR5-5600 supports memory-hungry vision and inference pipelines. Industrial variants to -40C for outdoor and cold-chain deployments. aReady.COM pre-configuration shortens time to market with ctrlX OS or Ubuntu Pro pre-installed. RTS Hypervisor support consolidates real-time control and AI on one module.
Applications
Sealed fanless industrial PCs, machine vision controllers, real-time robotics combining control and inference, medical and lab instrumentation, edge AI gateways, digital signage with on-device analytics, and industrial automation platforms being migrated from Ryzen Embedded 8000.
Request a Quote — CONGATEC CONGA-TCRP1 — COM EXPRESS TYPE 6 MODULE WITH AMD RYZEN AI EMBEDDED P100 AND 50 TOPS NPU
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