Specifications
Standard
COM Express R3.1 Compact Module, Type 6 pinout
SoC
Intel Core Ultra Series 3 processors
CPU
Up to 16 cores, configurable up to 65 W TDP
Total SoC AI
Up to 180 TOPS
PCIe
Up to 20 lanes PCIe Gen4
Operating Temperature
0 °C to 60 °C standard; -40 °C to 85 °C extended
Module Class
Compact size COM Express (95 × 95 mm class)
Carrier Requirement
Requires customer carrier board
Target Market
Ruggedised embedded computing, industrial AI, transportation
Overview
The Advantech SOM-6886 B1 is a COM Express R3.1 Compact Type 6 module on Intel Core Ultra Series 3, rated for up to 16 cores at a 65 W TDP with up to 20 lanes of PCIe Gen4 leaving the module and up to 180 TOPS of combined SoC AI throughput.
The Compact form factor is the differentiator: it occupies the 95 × 95 mm module class rather than Basic size, which is the smaller of the two Type 6 footprints. That makes it the right choice where the carrier board area is constrained but a modern Core Ultra SoC with a large PCIe fan-out is still required.
The B1 revision is offered with a -40 °C to +85 °C extended-temperature option alongside the standard 0–60 °C grade, covering transportation, outdoor and unheated-cabinet deployments. As with any COM, application I/O and connectors remain on the customer carrier, keeping the safety and certification envelope under the integrator's control.
Key Benefits
Compact Type 6 footprint saves carrier area versus Basic-size modules. Up to 65 W / 16 cores with 180 TOPS of SoC AI. 20 PCIe Gen4 lanes for multi-NVMe, multi-camera or NIC carriers. -40 to +85 °C extended grade available for transportation and outdoor systems.
Applications
Transportation and rail computing, ruggedised edge AI, industrial automation controllers, test and measurement instruments, and any embedded product where carrier area is limited but Core Ultra class compute is required.
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