Specifications
Product
Synopsys DesignWare HBM4/4E PHY and Controller IP
Generation
Sixth generation of Synopsys HBM IP
PHY Pin Bandwidth
Up to 12 Gbps per pin
Interface Bandwidth
Over 3 TBps aggregate
Controller Standard
JEDEC HBM4 / HBM4E
Controller Optimization
Tuned for power, latency, bandwidth and area
Test Chip
World's first HBM4 IP test chip
Test Chip Validation
9.2 Gbps wide-open eye (max rate of current HBM devices)
Future Headroom
Designed to support future HBM devices up to 12 Gbps
Application Markets
AI, HPC, graphics, networking, ASIC and SoC designs
Vendor
Synopsys (with Ansys, part of Synopsys)
Ecosystem
Pair with HBM4 DRAM stacks; multi-die / 2.5D-3D packaging flow
Overview
Synopsys DesignWare HBM4/4E IP is the sixth generation of the company's high-bandwidth memory interface family, comprising a PHY and a controller that together implement the JEDEC HBM4/4E standard for AI and HPC SoCs.
The HBM4 PHY delivers pin bandwidths up to 12 Gbps, giving an overall interface bandwidth of more than 3 TBps. The companion Controller IP is optimized for power, latency, bandwidth and area. Synopsys validated the technology with what it describes as the world's first HBM4 IP test chip, capturing wide-open eye diagrams at 9.2 Gbps — the maximum data rate of currently available HBM devices — while designing the PHY to support future devices at up to 12 Gbps.
The HBM4/4E IP targets AI accelerators, HPC, graphics, networking, ASIC and SoC designs that need the higher per-pin rates and bandwidth density of the HBM4 generation, and fits a multi-die packaging flow alongside Synopsys die-to-die and SerDes IP.
Key Benefits
12 Gbps per pin and >3 TBps more than double HBM3-class bandwidth per stack; first validated HBM4 test chip at 9.2 Gbps reduces integration risk on current parts and leaves headroom to 12 Gbps; power/latency/area-optimized controller suits area-constrained XPUs; single-vendor PHY+controller simplifies bring-up.
Applications
AI accelerator and XPU SoCs, HPC processors, graphics and networking ASICs, edge-inference SoCs and any multi-die design pairing HBM4/4E stacks with compute chiplets.
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