Specifications
Product
HBM4 PHY and Controller IP
Process Node
TSMC 3nm (N3P)
Data Rate
12 Gbps (signed off for HBM4E)
Bandwidth Gain
2.5x vs previous HBM3E IP
Power Efficiency
1.5x improvement vs HBM3E
Area Efficiency
2x improvement vs HBM3E
Packaging
TSMC CoWoS (S / R / L variants)
Predecessor
HBM3E PHY + Controller (15% above spec in production)
Monitoring
proteanTecs interconnect monitoring integrated
Controller Features
High bus utilization at random access, HBM4E speed
First
World's first HBM4 IP taped out on TSMC N3P
Applications
AI ASICs, HPC, advanced 2.5D/3D ICs
Overview
GUC (Global Unichip Corp.) offers an in-house HBM4 PHY and Controller IP implemented on TSMC's 3nm process. The company taped out the world's first HBM4 IP on TSMC N3P as a testchip and has demonstrated a full 12 Gbps HBM4 platform integrated with a partner's HBM4 memory using TSMC CoWoS advanced packaging.
Compared with its previous-generation HBM3E IP — which reached 15% above specification in customer 3nm products — GUC's HBM4 IP delivers 2.5x the bandwidth with 1.5x better power efficiency and 2x better area efficiency. The controller was upgraded for high bus utilization at random access and HBM4E speeds, and the IP integrates proteanTecs interconnect monitoring for PHY testing and in-field reliability. All TSMC CoWoS variants (S, R, L) are supported.
Key Benefits
Proven IP house: HBM3E in production at 15% above spec. 2.5x bandwidth: vs previous generation. Production-ready: CoWoS S/R/L packaging and proteanTecs monitoring.
Applications
AI ASICs and accelerators, HPC processors, 2.5D/3D advanced-packaging designs, HBM4/HBM4E memory subsystems.
Request a Quote — GUC HBM4 PHY & CONTROLLER IP — 3NM 12 GBPS HBM4 SUBSYSTEM
QS Compute — global B2B supply of AI computing hardware, edge AI systems and accelerators. Volume pricing, 15-day sample lead time.
Get Your Quote →