Specifications

Product Families

xiC (USB 3.1), xiQ (USB3 Vision), xiX (PCIe), xiX-XL (high resolution), xiRay (cooled X-ray), xiSpec (hyperspectral)

xiC Interface

USB 3.1 Gen 1, with Micro-B, Type-C or flex-ribbon connectors

xiC Resolution

2.3 MP to 24.5 MP on Sony Pregius global shutter sensors

xiC Peak Speed

24.5 MP at 31 fps; PCIe upgrade path at 10 Gbit/s

xiQ Form Factor

26 x 26 x 21 mm, under 1 W typical power consumption

xiQ Resolution

VGA to 4 MP, speeds up to 1000 fps using region of interest

xiX Interface

PCIe Gen 2 / Gen 3, X2 and X8 lane variants

xiX-XL Resolution

Up to 245.7 MP on backside-illuminated Sony IMX411 / IMX461 medium-format sensors

xiX-XL Feature

Modular design with detachable sensor heads for tight mechanical integration

Example PCIe Models

MX005MG-SY-X2G2 (IMX426, 0.5 MP, PCIe X2 Gen 2, 752 fps); CB013MG-LX-X8G3 and CB013CG-LX-X8G3 (Luxima LUX13HS, 1.1 MP, PCIe X8 Gen 3, 3709 fps)

Example USB Models

MQ013MG-E2-S7-BRD (e2v EV76C560, 1.3 MP, USB3, 61 fps, board level)

Scientific Models

MX377 - cooled sCMOS BSI astronomy and scientific camera with a large sensor

Shutter Types

Global shutter, rolling shutter and global reset, depending on the sensor

Sensor Vendors

Sony, onsemi, Luxima, e2v, CMOSIS and Aptina families

Form Factor

Board-level and housed versions; the xiC body is barely larger than a C-mount

Weight

Around 30 g for the compact xiC models

Power

Under 3 W for xiC; under 1 W for the smallest xiQ models

Cooling

Passive on industrial models; thermoelectric cooling on xiRay and scientific models

Spectral

xiSpec adds snapshot and line-scan hyperspectral imaging in a small USB3 body

Software

XIMEA API plus GenICam / GenTL compatibility for HALCON, MVTec and OpenCV

Embedded Support

Direct MIPI/PCIe integration for embedded SoM carriers and NVIDIA Jetson platforms

Cross-Brand

Basler dart and ace 2, FLIR Blackfly S board level, LUCID Phoenix, Vision Components VC MIPI

Overview

XIMEA's range is built around very small bodies and non-Ethernet interfaces. The xiC and xiQ families use USB 3.1 / USB3 Vision to keep the mechanical envelope down to roughly the size of the lens mount, which is what embedded vision designs generally need when the camera must fit inside a moving axis or a handheld instrument.

For speed, the xiX family moves to PCIe lanes. The PCIe Gen 3 X8 models on Luxima sensors reach several thousand frames per second at 1.1 MP, and the xiX-XL line pushes resolution to 245.7 MP on backside-illuminated medium-format Sony sensors with detachable sensor heads for awkward geometry.

Specialised members of the same family cover cooled X-ray imaging (xiRay) and small hyperspectral line-scan and snapshot imaging (xiSpec), so machine builders can standardise on one API across visible, X-ray and spectral inspection.

Key Benefits

Board-level and housed options from the same family, PCIe bandwidth for high-frame-rate capture without packet loss, and sub-3 W compact models suited to embedded and battery-powered instruments.

Applications

Embedded vision inside machinery, semiconductor and PCB inspection, high-speed motion analysis, X-ray inspection, hyperspectral sorting in agriculture and recycling, astronomy and scientific research imaging, UAV and mobile mapping payloads.

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