Specifications
Model
DepthVista Helix (also referenced as DepthVista Helix 3D CW iToF)
Depth Sensor
onsemi Hyperlux ID AF0130 continuous-wave indirect time-of-flight imager
Depth Resolution
1.2 MP class
Depth Technology
Dual-frequency continuous-wave iToF for stable measurements at longer distances
Depth Accuracy
Less than 1% deviation at distances up to 6 m
Data Streams
Simultaneous depth, confidence and IR output from a single capture
On-Camera Processing
Depth computed in the camera, reducing host computational load
Interfaces
USB, MIPI CSI-2 and GMSL options
Host Integration
Seamless integration with NVIDIA Jetson Orin and other embedded compute platforms
Enclosure
IP67-rated design for industrial and outdoor perception
Launch
Launched 17 February 2026, demonstrated live at NVIDIA GTC 2026 in a multi-camera edge AI solution
Use Pattern
Sensor head for robot cells where the compute box sits up to 15 m away on a GMSL link
Overview
The e-con Systems DepthVista Helix is a 1.2 MP continuous-wave indirect time-of-flight depth camera built on onsemi's Hyperlux ID AF0130 sensor. It captures depth, confidence and infrared frames simultaneously from one exposure, which removes the temporal mismatch that plagues stitched depth pipelines and gives a per-pixel confidence channel that downstream code can use to discard unreliable measurements.
The differentiator is dual-frequency continuous-wave operation. Single-frequency iToF sensors suffer from ambiguity and drift as distance grows; switching between two modulation frequencies resolves that ambiguity and holds accuracy to under 1% deviation out to 6 m. Depth is computed inside the camera, so a host does not have to spend CPU or GPU cycles on the depth pipeline before doing the perception work the application actually cares about.
DepthVista Helix ships with USB, MIPI CSI-2 and GMSL interface options and is designed to integrate directly with NVIDIA Jetson Orin and comparable embedded compute platforms. The enclosure is IP67-rated, so it suits bin-picking cells, palletisation systems, AMRs and outdoor industrial perception. e-con Systems demonstrated it at NVIDIA GTC 2026 as the depth sensor inside a multi-camera edge AI solution running on the Darsi Pro compute box alongside STURDeCAM GMSL cameras.
Key Benefits
Sub-1% depth deviation to 6 m through dual-frequency CW iToF, giving usable accuracy at working distances rather than only up close. Simultaneous depth, confidence and IR output for per-pixel reliability gating. On-camera depth processing that frees the host GPU for inference. Interface flexibility with USB, MIPI and GMSL so the same sensor serves a benchtop prototype and a rugged vehicle payload. IP67 sealing for industrial and semi-outdoor installation. Jetson Orin integration with a vendor that is an NVIDIA elite partner with a full camera portfolio.
Applications
Pick-and-place and bin-picking robots needing reliable depth at 1-6 m. Palletisation and depalletisation systems. Autonomous mobile robots and industrial safety cells. Smart agriculture and outdoor perception where IP67 matters. Multi-camera edge AI vision systems on Jetson Orin. Robotic arm guidance where confidence maps prevent bad grasps.
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