Specifications
Product
Uniflair Liquid to Liquid CDU
Capacity
Up to 1 MW per packaged unit
Approach Temperature
3 °C (ATD)
Pumps
Variable Frequency Drive (VFD) pumps
Heat Exchanger
Plate heat exchanger with low approach temperature
Technology Cooling System
TCS 25 or TCS 50 loops
Configuration
Packaged all-in-one solution
Deployment
Compact footprint for white space or grey space installation
Controls
Throughput, water pressure, server flow rate and fluid treatment control
Treatment
Fluid treatment and filtration as part of the CDU scope
Architecture Support
Direct-to-chip coldplate and chassis/tank immersion downstream
Complementary Products
Uniflair room cooling, InRow cooling, chillers, dry coolers, RDHx
Portfolio
Motivair by Schneider Electric CDU line also available
Experience Claim
Over a decade cooling racks beyond 400 kW
Standard
Part of the Schneider grid-to-chip, chip-to-chiller framework
Manufacturer
Schneider Electric
Application Class
AI data centers, HPC, high-density GPU halls
Lifecycle
Active production
Overview
Schneider Electric's Uniflair Liquid-to-Liquid CDU is the packaged all-in-one coolant distribution unit at the centre of its AI data center liquid cooling architecture. Capacities run to 1 MW with a 3 °C approach temperature, driven by variable-frequency-drive pumps, and the whole assembly is compact enough to be installed in white space or grey space rather than requiring a dedicated plant room.
A 3 °C approach matters more than it sounds. The approach is the gap between the secondary (technology cooling system) supply temperature and the primary (facility water) temperature; every degree of approach is a degree the facility water must be cooled below what the chips need. Holding 3 °C keeps the chiller set point high, which is what allows free cooling for more hours of the year and is the entire economic argument for warm-water direct-to-chip. VFD pumps then let the CDU match flow to actual IT load rather than running at nameplate.
The unit controls throughput, water pressure, server flow rate and fluid treatment as a single managed package, and supports TCS 25 and TCS 50 technology cooling loops for direct-to-chip coldplate and immersion heat loads. It sits inside a wider Schneider portfolio that also includes the Motivair CDU line, Uniflair room and InRow air cooling, rear-door heat exchangers, chillers and dry coolers — which means a facility can stage the transition from air to liquid without replacing the heat-rejection plant.
Key Benefits
Up to 1 MW in one packaged CDU matches a dense GPU hall segment without multiplying units. 3 °C approach keeps chiller set points high and extends free-cooling hours. VFD pumps track IT load and cut pumping energy. White-space or grey-space footprint avoids a dedicated plant room. Integrated fluid treatment and filtration reduces loop maintenance. Full portfolio behind it — CDUs, RDHx, InRow, chillers and dry coolers from one vendor.
Applications
AI training halls with direct-to-chip cold plates; HPC clusters; high-density colocation halls above 400 kW per rack row; immersion and chassis-level liquid deployments; data center liquid cooling retrofits; heat-rejection design where facility water temperature must stay high for free cooling.
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