Specifications
Product
Vertiv CoolChip CDU 1350 (next generation of Liebert XDU)
Heat Exchange
Liquid-to-liquid, up to 1,350 kW
Placement
In-rack, end-of-row or perimeter
Application
Chip-level (cold plate) and rear-door heat exchanger cooling
Input Voltage
480 V, 3 phase, 60 Hz
Pumps
Redundant, variable-speed pump controls
Controls
Colour touch-screen display, remote monitoring & comms
Dimensions
83.5 in (2122 mm) H × 35.4 in (900 mm) W × 48.9 in (1243 mm) D
Approvals
CE, cULus, RoHS
MPN
CoolChip CDU 1350
Application
The Vertiv CoolChip CDU 1350 is the highest-capacity liquid-to-liquid CDU in the Liebert XDU successor line, handling up to 1,350 kW of IT heat load per unit for GPU-dense AI training halls. It supports both direct-to-chip cold-plate loops and rear-door heat exchangers, and its footprint allows in-rack, end-of-row or perimeter installation so facility coolant stays isolated from the IT loop. QS Compute supplies the CDU together with manifolds, quick-disconnects and cold plates for a complete liquid loop.
Related Products
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