Specifications
Product Type
Coolant Distribution Unit (CDU)
Cooling Capacity
800+ kW @ 6K (850 LPM primary)
Catalog Number
CDU8004L002
Deployment
In-row / standalone (close-coupled)
Cooling Method
Direct-to-chip liquid cooling
Height
87.00 in / 2200 mm
Width
31.00 in / 800 mm
Depth
47.00 in / 1200 mm
Primary Coolant
Treated water with up to 20% propylene glycol
Liquid Temp Range
20 – 70 °C (68 – 158 °F)
Max Flow Rate
1200 LPM (317 GPM)
Pipe Connection
3-inch ID hygienic tri-clamp
Max Head Loss
1.3 bar @ 850 LPM (19 psi)
Max System Pressure
9 bar (130 psi)
System Volume
100 L (26 gal)
Secondary Filter
50 micron
Pump System
Redundant, leak-free, integrated VFDs
Electrical
380–480 V, 3-phase, 50/60 Hz, 47.5 A
Power Consumption
22.2 kW
Noise
68 dB
Dry Weight
2500 lb / 1134 kg
Standards
UL/cUL Listed (File SA7402), CE
Management
nVent Guardian Management Gateway + sensor portfolio
Overview
The nVent HOFFMAN RackChiller CDU800 is a rack-footprint coolant distribution unit engineered to supply liquid coolant safely and efficiently to direct-to-chip-cooled IT equipment. It is fed from a primary facility water system (FWS), while integrated pumps drive the secondary technology cooling system (TCS) loop; the internal heat exchanger transfers excess heat from the secondary coolant back to the primary.
Its defining characteristic is power density in a standard data center footprint: 800+ kW of cooling capacity at a 6K approach temperature inside an 800 x 1200 mm (31 x 47 in) cabinet. That makes it a fit for HPC, hyperscale, enterprise and colocation halls moving from air to liquid, without consuming additional white space.
Serviceability is designed in — the redundant pump system with integrated variable speed drives removes single points of failure, and the unit integrates with the nVent Guardian Management Gateway and sensor portfolio for monitoring and leak detection.
Key Benefits
800+ kW in a standard rack footprint — highest-capacity density per square meter in the RackChiller line. 6K approach temperature keeps supply coolant cool without over-provisioning chiller capacity. Redundant leak-free pumps with integrated VFDs eliminate single points of failure and match flow to load. Direct-to-chip ready with 3-inch hygienic tri-clamp primary connections, 50 micron secondary filtration and a 100 L loop volume. Standards-compliant — UL/cUL listed to File SA7402 and CE marked.
Applications
High-performance computing (HPC) clusters, hyperscale AI training halls, enterprise and colocation data centers, edge-adjacent high-density racks, and any facility retrofitting direct-to-chip liquid cooling onto a tier with limited available floor space.
Request a Quote — NVENT HOFFMAN RACKCHILLER CDU800 — 800 KW IN-ROW COOLANT DISTRIBUTION UNIT
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