Specifications
Cooling Technologies
Solid-state active air cooling (AirJet) and multi-stage 3D short-loop jetchannel direct-to-chip liquid cooling (LiquidJet)
AirJet Mini G2 Heat Removal
7.5 W per chip — 50% more than the original AirJet Mini at the same footprint
AirJet Mini G2 Features
Thin, light, silent, dustproof, water-resistant, vibration-free, no moving parts
AirJet PAK Variants
PAK 1C, PAK 3C, PAK 5C and next-gen PAK G2 / 5C-G2 plug-and-play thermal systems, 6 mm thick
AirJet PAK G2 Capability
Up to 45 W of compact, light, silent solid-state cooling for next-generation edge AI workloads
LiquidJet Hotspot Density
Supports 2x higher hotspot power density versus conventional coldplates
LiquidJet Heat Removal
Removes 75% more heat via multi-stage 3D short-loop jetchannels
LiquidJet Nexus
Integrated coldplate for 1/2U compute trays; weighs 2.5 kg; 65% lighter thermal stack; zero hoses and connectors
LiquidJet Nexus Inlet
100% liquid cooled, supports facility water inlet temperatures up to 53 degrees C
LiquidJet DLC Coldplate
Direct-to-chip coldplate validated for extreme hotspot cooling and up to 1,950 W of GPU heat
Manufacturing
Semiconductor-style manufacturing processes adapted to metal wafers, produced in Taiwan
Supported Edge Platforms
NVIDIA Jetson Orin Nano 4GB/8GB/Super, Jetson Orin NX 16GB, Jetson AGX Orin 64GB, Qualcomm Dragonwing IQ9, Snapdragon Ride4, AMD Kria KV260, Versal VEK280
OEM Adoption
Integrated by 20+ brands including Lenovo Active Flow and YUAN High-Tech AI cameras
Development Kit
SnowGoose AirJet development kit for edge AI and embedded prototyping
Data Center Products
LiquidJet DLC Coldplate and LiquidJet Nexus for AI factory racks and high-density GPU trays
Awards
CES 2026 Innovation Awards Honoree; PCWorld Best of IFA 2026
Availability
AirJet Mini Slim in mass production since 2023; AirJet PAK since Dec 2024; Mini G2 since Aug 2025; LiquidJet since Oct 2025; LiquidJet Nexus since Mar 2026
Company
Silicon Valley headquarters, Taiwan manufacturing; flagship products LiquidJet (data center) and AirJet (edge devices)
Overview
Frore Systems is a thermal technology pioneer whose AirJet and LiquidJet platforms address the two ends of the AI cooling problem: sustaining performance in ultra-compact, sealed edge devices, and removing extreme heat from high-density AI factory racks.
AirJet is the world's first solid-state active cooling chip. It uses vibrating membranes to generate high-velocity pulsating air jets that pull heat through the chip and exhaust it, replacing bulky fans with a thin, silent, dustproof and water-resistant module. The AirJet Mini G2 removes 7.5 W of heat in the same footprint as the original Mini, while AirJet PAK modules integrate one or more chips into plug-and-play thermal systems for 24/7 edge AI deployments.
LiquidJet brings semiconductor manufacturing processes to data center thermal design. Its multi-stage 3D short-loop jetchannels remove 75% more heat and support 2x higher hotspot power density than conventional coldplates. LiquidJet Nexus integrates the coldplate directly into half-U compute trays, eliminating hoses and connectors and cutting thermal-stack weight by 65%.
Key Benefits
Silent, vibration-free active cooling with no moving parts. AirJet sustains full performance in sealed, dust-exposed and outdoor edge enclosures where fans fail, while LiquidJet Nexus reduces thermal-stack weight and improves PUE in liquid-cooled AI factories.
Applications
Edge AI devices, industrial embedded platforms, mini PCs, AI cameras, notebook and handheld designs, rugged and sealed enclosures, optical transceivers, SSD accessories, and high-density GPU and AI factory racks.
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