Specifications
Portfolio
AdrenaLINE 224G: near-chip connectors, cabled backplane, cabled I/O, in-house 224G cable
Product Lines
AdrenaLINE Fastlane, Slingshot, Catapult and Micro LGA Socket
Signalling
224 Gbps PAM4 per lane across the 224G portfolio
Near-Chip
AdrenaLINE Catapult for over-the-board (OTB) pluggable I/O ports
Cabled Backplane
AdrenaLINE Slingshot cabled backplane connector system
OSFP I/O
Aggregate 200 Gbps up to 1.6T per port
OSFP Cable Assemblies
224G DAC / ACC / AEC copper cable assemblies
QSFP-DD
Up to 800 Gbps per port, 8-lane, 28G NRZ / 56G / 112G PAM4
QSFP-DD Thermal
Proprietary heat sink cage design for 15-18 W modules
CDFP
Among the highest port and bandwidth density pluggable I/O available
Power Distribution
CROWN CLIP Jr. and MULTI-BEAM XLE plug-and-play datacenter power cable assemblies
Micro LGA Socket
AdrenaLINE Micro LGA socket for co-packaged and near-package placement
Standards
PCIe Gen 6, OCP-aligned form factors and 224G Ethernet ecosystems
Design Intent
Built specifically for GPU module integration and cabled system architectures
Applications Fit
1 MW AI racks, 102.4T switch fabrics, co-packaged optics hosts
Overview
TE Connectivity's AdrenaLINE 224G portfolio is a deliberately end-to-end answer to AI rack interconnect: near-chip connectors, cabled backplane, cabled I/O and the 224G cable itself are produced in-house. The design intent is GPU module integration - 224 Gbps PAM4 signalling is cabled out of the package to relieve the signal integrity constraints that a conventional PCB trace cannot meet.
AdrenaLINE Catapult handles over-the-board pluggable I/O, moving high-speed signals from the front panel toward the chip, while AdrenaLINE Slingshot provides the cabled backplane system for rack-scale fabrics. The Micro LGA socket covers co-packaged and near-package placement, a topology that 224G designs increasingly demand.
Around the 224G signalling chain TE supplies the rest of the rack interconnect: OSFP connectors and cable assemblies scaling from 200 Gbps to 1.6T, QSFP/QSFP-DD cages rated for 15-18 W optics, CDFP for maximum port density, and plug-and-play power distribution with CROWN CLIP Jr. and MULTI-BEAM XLE connectors.
Key Benefits
Single-vendor 224G path: near-chip, cabled backplane, cabled I/O and in-house 224G cable from one portfolio. Relieves SI pressure: cabling signals out of the package is the practical route past 224G channel loss. Complete rack ecosystem: I/O cages, cable assemblies and power connectors matched to the same 224G architecture.
Applications
GPU module integration in AI racks, cabled backplane systems for 102.4T switch fabrics, over-the-board pluggable I/O ports, co-packaged and near-package connector hosts, 800G and 1.6T datacenter I/O, datacenter power distribution.
Request a Quote — TE CONNECTIVITY ADRENALINE 224G INTERCONNECT PORTFOLIO — NEAR-CHIP, CABLED BACKPLANE AND OSFP I/O FOR AI SYSTEMS
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