Amphenol ExtremePort OSFP 224G Interconnect — 0.6 mm Pitch Pluggable I/O, Celerity and XPO Solutions

Specifications

Overview

Amphenol's ExtremePort OSFP 224G connector builds on a 60-contact, 0.6 mm pitch footprint shared across the OSFP 112G, OSFP 224G and OSFP-XD 112G families, so a platform can be designed once and populated at either generation. The 0.6 mm pitch form factor is explicitly optimized for both signal integrity and thermal performance - a combination that matters as pluggable power dissipation rises with each speed node.

The portfolio reaches well beyond the front panel. QSFP-DD 224G covers 38-position, 0.80 mm pitch double-density I/O; ExaMAX2 and ExaMAX+ handle 112 Gb/s backplane traffic; and the Celerity 224 Gb/s PAM4 mezzanine BGA connector integrates power into a board-to-board mezzanine - a shape that AI accelerator and switch module designs are adopting to shorten high-speed channels.

For the most aggressive architectures Amphenol supplies co-packaged copper (XtremePass), the XPO OverPass assembly for AI and cloud infrastructure, and the XPO-LPO optical transceiver at 12.8 Tb/s with 224 Gb/s per lane. SkewClear twin-axial cable in 8-pair and 16-pair constructions provides softer bending than standard twinax for dense routing around GPU modules.

Key Benefits

One footprint, two generations: identical OSFP footprint across 112G, 224G and OSFP-XD simplifies platform refresh. Thermal-aware connector design: 0.6 mm pitch optimized for SI and thermal at 224G. Copper plus optics: a single vendor covering pluggable copper, co-packaged copper and 12.8T optical for AI fabrics.

Applications

GPU rack and switch front-panel I/O, 102.4T switch fabrics, co-packaged copper and optics architectures, AI accelerator mezzanine modules with integrated power, storage and compute backplanes, high-density cloud and hyperscale deployments.

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