Specifications

Si-Fly HD Data Rate

224 Gbps PAM4 per differential channel

Si-Fly HD Density

Up to 2,048 differential pairs in one open rack unit (OU)

Si-Fly HD Aggregate

7.2 Tbps per 64-pair (8x8) connection

Cable Technology

Eye Speed hyper low skew twinax, 1.75 ps/m max intra-pair skew

Si-Fly HD Products

SBCF cable socket / SBCM cable header

NovaRay Data Rate

128 Gbps PAM4 backplane (112 Gbps PAM4 micro rugged)

NovaRay Density

Up to 128 differential pairs per single connector

NovaRay Pitch / Compliance

0.90 mm pitch, PCIe 7.0 capable, blind-mate capable

NovaRay Products

NVBF, NVBM-RA, NVCF, NVCM-RA (in development)

ExaMAX Data Rate

112 Gbps PAM4 cable / 64 Gbps PAM4 (32 Gbps NRZ) board-to-board

ExaMAX Pitch / Pairs

2.00 mm column pitch, 24-48 differential pairs per connector

ExaMAX Mating Force

0.36 N max per contact - lowest mating force on the market

ExaMAX Compliance

PCIe 6.0 / CXL 3.2 capable, Telcordia GR-1217 CORE

ExaMAX Products

EBTM, EBTM-RA, EBTF-RA, EBDM-RA, EBCM, EBCF, EBCL, EBCB

XCede HD Density

Up to 84 differential pairs per linear inch

XCede HD Configurations

1.80 mm pitch, 3/4/6-pair, 12-48 pairs, 85 ohm and 100 ohm options

Guide & Power Modules

SureWare EGBM/EGBF guides, EPTT/EPTS power modules

Target Applications

AI accelerator racks, 102.4T switch fabrics, cable backplane systems

Overview

Samtec's high-speed backplane family spans the full range of AI-rack interconnect requirements, from the 224 Gbps PAM4 Si-Fly HD cable backplane system through NovaRay micro rugged, ExaMAX and XCede HD. For GPU and switch platforms pushing past 51.2T of switching capacity, the cable backplane is where signal integrity budget is won or lost.

Si-Fly HD combines Eye Speed hyper low skew twinax cable at 1.75 ps/m max intra-pair skew with an open-rack-unit form factor carrying up to 2,048 differential pairs - 7.2 Tbps of aggregate bandwidth per 64-pair connection. NovaRay extends micro rugged backplane performance to 128 Gbps PAM4 with 128 differential pairs per connector on a 0.90 mm footprint, and is PCIe 7.0 capable.

ExaMAX remains the workhorse high-density backplane platform: 112 Gbps PAM4 over Flyover cable, 64 Gbps PAM4 board-to-board on 2.00 mm column pitch, two reliable points of contact under angled mating, and the lowest mating force available at 0.36 N max per contact. The family is PCIe 6.0 / CXL 3.2 capable and meets Telcordia GR-1217 CORE.

Key Benefits

Purpose-built for AI rack scale: 224 Gbps PAM4 density that keeps 102.4T switch and GPU rack interconnect inside a single open rack unit. Signal integrity margin: 1.75 ps/m max intra-pair skew twinax preserves channel margin at 224G. Design flexibility: co-packaged, near-chip and cabled backplane options from the same connector family, with power and guide modules integrated.

Applications

AI accelerator racks and GPU trays, 102.4T and 51.2T switch chassis, co-packaged and near-chip copper connectivity, cable backplane systems, high-density storage backplanes, HPC and hyperscale data center interconnects.

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