Specifications
Product Lines
N745-M80 (Gen3), P250Q-M80 (Gen4 with data destruction), N845-M30 (Gen3, M.2 2230)
N745-M80 Interface
PCIe Gen3 x4, NVMe 1.3, M.2 2280 (80 mm)
N745-M80 Capacities
128 GB / 256 GB / 512 GB / 1 TB
N745-M80 Performance
Up to 2,100 MB/s sequential read, 1,600 MB/s sequential write
N745-M80 Power
3.3 V x 775 mA max
P250Q-M80 Interface
PCIe Gen4 x4, M key, M.2 2280
P250Q-M80 Capacities
256 GB / 512 GB / 1 TB / 2 TB (TE1TP250MM80-QE for 1 TB)
P250Q-M80 Performance
Up to 7,000 MB/s sequential read, 5,500 MB/s sequential write
P250Q-M80 Data Destruction
One-click button with dual erasure modes selected by press duration, independent destruction circuit, LED status (Taiwan utility patent M662727)
N845-M30 Interface
PCIe Gen3 x4, NVMe 1.4, M.2 2230 (30 mm)
N845-M30 Capacities
256 GB / 512 GB — TE256GN845KM30 and TE512GN845KM30, wide-temp -W variants
N845-M30 Performance
Up to 3,100 MB/s read, 1,800 MB/s write with HMB host memory buffer (DRAM-less)
NAND Technology
112-layer BiCS 3D TLC, SLC caching, LDPC ECC
Temperature Range
Wide temp models: -40 to +85 degrees C operating; storage -55 to +95 degrees C
Endurance
3K P/E cycles and 3,000 wear-levelling counts with global wear levelling and garbage collection
Reliability
Over 3 million hours MTBF, end-to-end data protection, TRIM, S.M.A.R.T. smart tool
Ruggedness
MIL-STD-202G shock (50 G / 11 ms operation) and MIL-STD-810G vibration compliance
Security and Management
TCG Opal support and TEAMGROUP S.M.A.R.T. monitoring tool (Taiwan patent I751753)
Warranty
3-year limited warranty
Applications
AIoT, medical care, factory automation, server and netcom, embedded systems
Overview
TEAMGROUP's industrial SSD line covers the three form factors that embedded and edge designs actually use: M.2 2280 for storage-dense systems, M.2 2230 for space-constrained boards, and a Gen4 line for applications that need both throughput and physical data control. All three families are built on 112-layer BiCS 3D TLC NAND with SLC caching, LDPC error correction and wide-temperature options for deployment outside climate-controlled rooms.
The N745-M80 is the mainstream industrial drive: PCIe Gen3 x4 over NVMe 1.3 in a 2280 form factor, 128 GB to 1 TB, up to 2,100 / 1,600 MB/s, and wide-temperature operation from -40 to +85 degrees C. It carries a thermal sensor, S.M.A.R.T. monitoring and MIL-STD ruggedisation, which is the usual requirement set for AIoT gateways, medical devices and factory-floor controllers.
The P250Q-M80 is the unusual one. It is a Gen4 x4 drive rated at 7,000 / 5,500 MB/s in 256 GB to 2 TB capacities, but it also carries a physical one-click data-destruction button. A short press and a long press trigger different erasure modes, an independent destruction circuit isolates the erase path, and LEDs report status — a hardware answer to secure decommissioning that does not depend on host software. The N845-M30 plays the opposite role: a DRAM-less M.2 2230 (30 mm) drive using host memory buffer, 256 or 512 GB, up to 3,100 / 1,800 MB/s, in standard and wide-temperature part numbers.
Key Benefits
Wide temperature by design: -40 to +85 degrees C operation on wide-temp SKUs covers unheated cabinets and outdoor enclosures. Hardware data destruction: the P250Q-M80 erases on a button press through an isolated circuit, independent of host software. Smart 2230 option: the N845-M30 fits 30 mm M.2 slots using HMB instead of costly onboard DRAM. Industrial durability: MIL-STD-202G shock and MIL-STD-810G vibration, over 3 million hours MTBF. Documented part numbers: TE1TP250MM80-QE, TE256GN845KM30 and wide-temp -W variants make procurement unambiguous.
Applications
Industrial IoT gateways and edge AI boxes, medical imaging and diagnostics equipment, factory automation and motion controllers, in-vehicle and transportation systems, network appliances and telecom, and any embedded design requiring either wide-temperature operation or verifiable data destruction at decommissioning.
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