Specifications
Part Number
MTFDKCC3T8TGP-1BK1DABYY
Series
Micron 7500 PRO
Capacity
3.84 TB
Form Factor
U.3 (2.5-inch, 15 mm)
Interface
PCIe Gen4 x4, NVMe 2.4b
NAND
Micron 232-layer (200+) 3D TLC NAND
Endurance
1 DWPD, 5-year warranty
Sequential Read
Up to 6,800 MB/s
Sequential Write
Up to 5,300 MB/s
Random Read (4K)
Up to 1,100K IOPS
Random Write (4K)
Up to 180K IOPS
Latency
Sub-1 ms QoS (6x9s)
Security
TCG Opal 2.0, SHA-512, RSA, SPDM 1.2, Micron SEE
MTTF
2.5 million device hours @ 50 °C
Power (seq. read/write)
15.5 W / 18.3 W
Target Workload
Mainstream read-intensive / mixed
Overview
The Micron 7500 PRO MTFDKCC3T8TGP-1BK1DABYY is a 3.84 TB mainstream data center NVMe SSD in the 15 mm U.3 form factor. It is the first mainstream enterprise drive built on Micron 232-layer (200+) 3D TLC NAND, which is the change that lifts sequential throughput to 6,800 MB/s and keeps 6x9s QoS latency below 1 ms under sustained mixed load.
The 1 DWPD PRO endurance point suits read-intensive and mixed-workload tiers: content delivery, analytics, virtualisation and general-purpose server boot/data volumes. Because the drive is a straight Gen4 x4 U.3 device on NVMe 2.4b, it drops into the same backplane slots as the 7450 it succeeds and needs no platform change - which is why Gen4 U.3 remains the mainstream volume tier even after Gen5 arrived.
Security is a differentiator at this tier: TCG Opal 2.0 self-encryption, SPDM 1.2 attestation, SHA-512 and RSA, backed by Micron's Secure Execution Environment (SEE). A 7450/7500 generation common platform also means firmware and management tooling are shared across the family.
Key Benefits
232-layer NAND — class-leading throughput and better IOPS/W at the mainstream tier. Sub-1 ms 6x9s QoS — predictable latency for databases and real-time analytics. Enterprise security stack — TCG Opal, SPDM 1.2 attestation, SEE. U.3 drop-in — same slot and tooling as the 7450 generation.
Applications
General-purpose and virtualisation servers, content delivery and streaming caches, real-time analytics, cloud block storage, AI data-pipeline staging tiers, and boot/data volumes where Gen4 U.3 density matters more than peak Gen5 bandwidth.
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