Specifications
Family
Virtium StorFly M.2 NVMe
Classes
StorFly Series 3 (3D TLC) · StorFly XE (industrial-grade pSLC)
Form Factors
JEDEC M.2 2280 (22 x 80 mm), M.2 2242 (22 x 42 mm), M.2 2230 (22 x 30 mm)
Interface
PCIe Gen3 and PCIe Gen4, x1 / x2 / x4 configurable
Protocol
NVMe 1.2 / NVMe 1.3
Temperature Range
-40 °C to +85 °C (industrial, no performance drop across range)
Capacity Range
Series 3 up to 2 TB · XE class 8 GB to 640 GB+
Endurance
XE class pSLC: up to 10x standard 3D TLC write endurance
Voltage / Power
3.3 V / 1.7 W
Power-Fail Protection
vtGuard
Security
vtSecure self-encrypting drive: AES encryption, crypto/secure erase, drive sanitization, TCG optional
Management Software
StorKit SSD monitoring and management
Product Longevity
10+ year product availability (XE class)
Ruggedisation
Shock and vibration qualified for embedded industrial use
Overview
Virtium's StorFly M.2 NVMe range is built for embedded systems that cannot tolerate the temperature and power behaviour of client or datacenter drives. The drives are offered in JEDEC M.2 2280, 2242 and 2230 lengths and run PCIe Gen3 / Gen4 with x1, x2 and x4 lane configuration, so a host board can trade bandwidth for power and heat.
Two product classes cover different write profiles: StorFly Series 3 uses 3D TLC for boot, OS and logging volumes, while StorFly XE class uses industrial-grade pSLC to deliver up to ten times the write endurance of standard 3D TLC at capacities from 8 GB to 640 GB and beyond. Every drive carries vtGuard power-fail protection and vtSecure AES self-encryption with crypto-erase sanitisation.
Key Benefits
True industrial temperature of -40 °C to +85 °C without the throughput cliff client drives show when hot, vtGuard power-fail protection for unreliable industrial supplies, and 10+ year product availability so a design does not need a storage re-qualification mid-life.
Applications
Industrial PCs and panel computers, transportation and rail control units, telecoms and 5G edge cabinets, optical networking line cards, robotics and motion controllers, medical instruments and ruggedised field computing.
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