Specifications
Form Factor
OSM-MF v1.2 standard, 45 x 30 mm, solder-down (single carrier supports multiple processor, memory and wireless options)
SoC
Texas Instruments Sitara AM67A (AM67x family)
Application Cores
4x Arm Cortex-A53 up to 1.4 GHz
Real-Time MCUs
3x Arm Cortex-R5F up to 800 MHz (application MCU, device management, run-time management)
Deep Learning Accelerators
Two DLAs, each up to 40 GFLOPS and 2 TOPS, 4 TOPS total
GPU
PowerVR BXS 4-64 MC1, up to 50 GFLOPS FP32, OpenGL ES 3.2 and Vulkan 1.2
Vision Pipeline
Onboard VPAC vision accelerators plus ISP rated 600 MP/s with HDR
Camera Interface
4x 4-lane MIPI-CSI-2, up to 16 virtual channels per CSI-2 link
Display Output
1x MIPI DSI to 3840 x 1080 at 60 fps; 2x LVDS to 1920 x 1080 at 60 fps single link or 3840 x 1080 at 60 fps dual link
Video
Hardware video encode and decode up to 4K60
Memory
4 GB or 8 GB LPDDR4
Storage
16 GB eMMC
Networking
2x Gigabit Ethernet with IEEE 1588 and TSN support
Wireless Options
Sona TI351 (TI CC3351) Wi-Fi 6 with Bluetooth LE 5.4, or Sona IF513 (Infineon AIROC CYW55513); de-populated variant also offered
High-Speed Interfaces
1x PCIe Gen3 1-lane (8 Gbps), USB 3.1 Gen1 (5 Gbps), 1x USB 2.0 (480 Mbps)
Industrial I/O
2x CAN-FD, 4x 4-wire UART, 1x 2-wire UART, 4x I2C, 3x SPI (1x QSPI), 1x I2S, 1x SDIO 3.0 / eMMC 5.1
GPIO and Analog
31x GPIO, 7x PWM, 4x ADC
Security
Secure enclave with secure boot, signed images and provisioned/encrypted certificates
Temperature Range
0C to +70C commercial, or -40C to +85C industrial
Power Input
5V
Product Lifecycle
10+ years with LTS software, OTA updates and an upgrade path for future Wi-Fi/BT modules
Part Numbers
EZOMI-67A-0416-xxxx (4GB) and EZOMI-67A-0816-xxxx (8GB), with -2C cut-tape and -2-IK interposer variants
Status
Preview, samples shipping; distributed via DigiKey and Mouser
Overview
The Ezurio Carbon AM67 OSM-MF is a solder-down system-on-module built on Texas Instruments' Sitara AM67A processor and supplied in the OSM-MF v1.2 open standard form factor, 45 x 30 mm. Because OSM is an SGET standard rather than a proprietary format, one carrier board design can accept multiple processor, memory and wireless arrangements - removing both vendor lock-in and connector supply risk while keeping the cost, thermal and vibration advantages of soldering the module down.
The AM67A is built for heterogeneous workloads: four 1.4 GHz Cortex-A53 cores run Linux, while three 800 MHz Cortex-R5F cores are dedicated to an application MCU, device management and run-time management, so multiple RTOSes and Linux can run simultaneously on separate cores. Two deep learning accelerators provide up to 40 GFLOPS and 2 TOPS each for 4 TOPS total on-module inference.
The vision pipeline is the strongest differentiator. Four 4-lane MIPI-CSI-2 interfaces each support up to 16 virtual channels, fed through onboard VPAC vision accelerators and a 600 MP/s ISP with HDR - enough for surround-view, stereo and multi-camera inspection arrays directly from the module. Dual Gigabit Ethernet with IEEE 1588 and TSN covers time-sensitive industrial networking, and three independent display outputs to 3840 x 1080 handle HMI and medical imaging products. Modules carry a 10+ year lifecycle with LTS software and OTA updates.
Key Benefits
Open standard OSM-MF solder-down format avoids proprietary SOM lock-in and lets one carrier serve multiple configurations; 4 TOPS of on-module deep learning acceleration from two DLAs; quad 4-lane MIPI-CSI-2 with 16 virtual channels per link plus a 600 MP/s ISP for multi-camera vision; four Cortex-A53 plus three Cortex-R5F cores for Linux and RTOS coexistence; dual Gigabit Ethernet with IEEE 1588 and TSN; 4GB or 8GB LPDDR4; commercial and -40C to +85C industrial ratings; 10+ year lifecycle with OTA updates.
Applications
Multi-camera machine vision and inspection, industrial HMI and medical imaging products, edge AI inference appliances, robotics and autonomous platforms, time-sensitive industrial networking nodes, building automation and access control, transport and automotive systems.
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