Specifications
MPN
LIFCL-40-8BG256I
Device
LIFCL-40
Family
Lattice CrossLink-NX
Package
BG256 (256-ball caBGA)
Speed Grade
8
Temperature Grade
I — industrial (-40 °C to +100 °C)
Logic Cells
39,000
Embedded Block RAM (kbit)
1,512
Large RAM / LRAM (kbit)
1,024
18 × 18 Multipliers
56
Hardened 10 Gbps D-PHY Quads
2
5 Gb/s PCIe Gen2 Hard IP
1
ADC Blocks
2
GPLLs
3
Toolchain
Lattice Radiant
Vendor
Lattice Semiconductor
Overview
The LIFCL-40 (ordering code LIFCL-40-8BG256I) is the largest CrossLink-NX device: 39,000 logic cells, 1,512 kbit of embedded block RAM, 1,024 kbit of large RAM and 56 eighteen-by-eighteen multipliers in a 256-ball caBGA, built on a 28 nm FD-SOI process.
CrossLink-NX is purpose-built as an embedded-vision bridge. Two hardened 10 Gbps MIPI D-PHY quads let it receive high-resolution CSI-2 sensor streams without consuming programmable logic, while a hardened 5 Gb/s PCIe Gen2 block and three GPLLs handle the host-side interface. The result is a single low-power device that can aggregate, convert and re-transmit camera data between MIPI, SLVS-EC, PCIe and parallel interfaces — the standard role in machine-vision cameras, automotive sensor fusion and medical imaging heads. Two ADC blocks are available for analogue monitoring. Designs are built in Lattice Radiant. We supply the LIFCL-40-8BG256I factory-sealed through distribution channels — contact us for availability and pricing.
Key Benefits
Hardened 10 Gbps D-PHY means MIPI CSI-2 does not consume fabric; FD-SOI process gives low soft-error rate and low power; single-chip sensor-to-PCIe bridge; 2.5 Mbit of combined on-chip RAM for frame buffering.
Applications
Machine-vision and industrial cameras, MIPI CSI-2 aggregation, automotive ADAS sensor fusion, medical endoscopy and imaging heads, AR/VR headsets, embedded vision bridges to PCIe hosts.
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