Specifications

MPN

XCZU17EG-2FFVC1760I

Device

XCZU17EG

Family

AMD Zynq UltraScale+ MPSoC (EG)

Package

FFVC1760 (1760-ball FCBGA)

Speed Grade

-2

Temperature Grade

I — industrial (-40 °C to +100 °C Tj)

System Logic Cells (K)

926

Total RAM (Mb)

64.7

DSP Slices

1,590

16.3 Gb/s Transceivers

44

32.75 Gb/s Transceivers

28

PCI Express

(2x Gen3x16 and 1x Gen3x8) or 4x Gen3x8

Maximum I/O Pins

668

Application Processing Unit

Quad-core Arm Cortex-A53 MPCore up to 1.5 GHz

Real-time Processing Unit

Dual-core Arm Cortex-R5F MPCore up to 600 MHz

Graphics Processing Unit

Arm Mali-400 MP2 up to 667 MHz

Dynamic Memory Interface

DDR4, LPDDR4, DDR3, DDR3L, LPDDR3

High-Speed Peripherals

PCIe Gen2, USB 3.0, SATA 3.1, DisplayPort, Gigabit Ethernet

On-chip Memory

256 KB with ECC

Toolchain

AMD Vivado / Vitis unified software platform

Vendor

AMD

Overview

The XCZU17EG (ordering code XCZU17EG-2FFVC1760I) is an AMD Zynq UltraScale+ MPSoC device in the FFVC1760 package. It integrates 926K system logic cells, 64.7 Mb of total on-chip RAM, 1,590 DSP48E2 slices and 44 16.3 Gb/s transceivers alongside a full processing system: a quad-core Arm Cortex-A53 application processor running at up to 1.5 GHz, a dual-core Arm Cortex-R5F real-time processor at up to 600 MHz, and an Arm Mali-400 MP2 graphics processor.

The PCIe block provides (2x Gen3x16 and 1x Gen3x8) or 4x Gen3x8, and the device exposes up to 668 I/O pins. The processing system supports DDR4, LPDDR4, DDR3, DDR3L and LPDDR3 memory and carries PCIe Gen2, USB 3.0, SATA 3.1, DisplayPort and Gigabit Ethernet peripherals. Designs are built with AMD Vivado and Vitis; the same architecture scales down to the ZU1EG and up to the ZU19EG without a toolchain or IP change. We supply the XCZU17EG-2FFVC1760I factory-sealed through distribution channels — contact us for availability, lead time and volume pricing.

Key Benefits

Deterministic hard real-time via the dedicated Cortex-R5F RPU alongside the A53 application cores; scoop-proof single-chip integration of FPGA fabric, DSP and application processing; PCIe Gen3x16-class host connectivity; AMD Vivado/Vitis toolchain and long-life industrial availability.

Applications

Embedded vision and video transport, radar/SDR and defence electronics, industrial motor control, 5G and wireline infrastructure, medical imaging, ADAS prototyping and machine-vision cameras.

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