Specifications
Family
AMD Spartan UltraScale+ XA — automotive grade
Device
XASU35P
System logic cells
36K
CLB LUTs
16K
DSP slices
48
Total RAM
1.93 Mb
Maximum I/O pins
304
Transceivers
None (logic and I/O device)
PCI Express
None
MIPI D-PHY
Lane rate up to 2.5 Gb/s for point-cloud generation
Package options
12 x 12 mm and chip-scale package
Process node
16 nm FinFET, up to 30% lower total power than the previous generation
Automotive qualification
ISO 26262 functional safety and AEC-Q100 temperature grades
I/O ratio
Highest I/O-to-logic-cell ratio among FPGAs built on 28 nm and lower processes
Status
Devices in production and shipping
Target applications
LiDAR data ingestion, camera vision and image/video pre-processing, automotive sensor fusion, edge ADAS
Overview
The Spartan UltraScale+ XA family is AMD's automotive-grade expansion of the Spartan UltraScale+ line. The XASU35P device delivers 36K system logic cells, 16K LUTs, 48 DSP slices, 1.93 Mb of RAM and 304 I/O pins, with up to 2.5 Gb/s MIPI D-PHY lanes to ingest sensor data for point-cloud generation.
Packaging is deliberately small — the part ships in a 12 x 12 mm body and a chip-scale package aimed at higher routing density, better solder-joint reliability and improved electrical performance. AMD qualifies the family to ISO 26262 functional safety and AEC-Q100 temperature grades, positioning it for cameras and LiDAR front ends where the FPGA pre-processes data before it reaches an application processor.
Key Benefits
304 I/O on 36K logic cells lets one small device fan out to multiple sensors. 2.5 Gb/s MIPI D-PHY directly ingests high-rate LiDAR and camera lanes. 12 x 12 mm and chip-scale options fit inside camera modules and sensor housings. ISO 26262 and AEC-Q100 meet automotive qualification without a separate screening programme.
Applications
LiDAR data ingestion and point-cloud generation, automotive camera pre-processing, ADAS sensor fusion front ends, in-cabin and surround-view modules, and industrial sensing where AEC-Q100-grade parts and a small footprint are required.
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