Specifications

Family

AMD Xilinx Spartan-7 (7-series)

Device

XC7S50

MPNs (package / speed variants)

XC7S50-1CSGA324C (-1CSGA324I) · XC7S50-2CSGA324C · XC7S50-1FTGB196C · XC7S50-2FGG484C

Process

28 nm HKMG — same fabric family as Artix-7/Kintex-7

Logic Cells

52,160

Configurable Logic Blocks

8,150 slices

Flip-Flops

65,200

DSP Slices

120 × DSP48E1

Block RAM

2,700 Kb (75 × 36 Kb blocks)

Distributed RAM

600 Kb

Clock Management

5 CMTs (MMCM + PLL)

Transceivers

None — Spartan-7 has no multi-gigabit GTP/GTX lanes

PCI Express

Not supported (no hard block on this family)

Memory Interface

DDR3 / DDR3L / LPDDR2 up to 800 Mb/s via soft MIG controller

Configuration

SRAM-based, external SPI/QSPI flash or host CPU

Packages

CSGA324, FTGB196, FGG484, FGG676

Speed Grades

-1, -2

Temperature Grades

C (0 to +85 °C), I (-40 to +100 °C), Q (defence)

Core Voltage

0.95 V core (1.0 V nominal for -1 devices), 1.2-3.3 V I/O

Target Use

Sensor fusion, motor and power control, bridge glue logic, cost-driven vision front-ends

Overview

Spartan-7 is the cost-optimised entry into the AMD 7-series architecture. The XC7S50 offers 52,160 logic cells, 120 DSP48E1 slices and 2,700 Kb of block RAM on the same 28 nm HKMG process as Artix-7, but with the multi-gigabit transceivers removed to cut die area and price.

That trade-off makes it the right device for designs that need real parallel logic and DSP — sensor fusion, multi-axis motor control, custom glue logic — but do not need 6 Gb/s serial links. It uses the same Vivado flow and IP catalogue as the rest of the 7-series, so code moves to Artix-7 or Kintex-7 with no re-write.

Key Benefits

7-series architecture at cost-optimised pricing — same tool flow, same IP, smaller die. 120 DSP slices and 2,700 Kb BRAM handle real-time control and filtering in fabric. Small CSGA324 and FTGB196 packages suit space-constrained industrial boards.

Applications

Industrial sensor fusion and I/O expansion, multi-axis motor and motion control, power-converter control loops, cost-driven vision front-ends, bridging and protocol conversion, and automotive body electronics.

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