Chenbro RM35206 FIO — 3U Short-Depth GPGPU Edge Server Chassis

Specifications

Overview

The Chenbro RM35206 FIO is the 3U member of Chenbro's short-depth edge computing chassis family. Where the 2U RM252 MIO delivers two full-height GPGPU cards, the RM352 trades one extra rack unit for more vertical expansion room, more cooling volume and more drive positions — all inside the same 18-inch depth envelope that fits shallow edge, telco and wall-mount racks.

It accepts E-ATX and SSI EEB motherboards with dual CPUs, so it can host a full server-class platform rather than a single-socket edge board. Storage is handled by eight hot-swap 2.5-inch SAS/SATA bays, and CRPS redundant power supplies are supported for continuous-operation sites.

The chassis is designed for serviceability in constrained spaces. Hot-swap fan modules can be accessed and changed without disturbing the host platform, and the front-I/O layout concentrates cabling at the cold aisle. Where storage demand exceeds the chassis, the DS25224 2U short-depth JBOD expands the same platform, and Chenbro's RM25324 and RM256 variants extend the family into edge-storage configurations.

Chenbro positions the 18-inch platform for central office and base station applications, along with graphics, simulation and machine learning workloads that need parallel processing without the depth of a standard rack server.

Key Benefits

18-inch short depth fits central-office, base-station and shallow edge racks. 3U of vertical expansion for full-height GPGPU cards plus cooling headroom. Dual-socket E-ATX / SSI EEB support for server-class platforms. Eight hot-swap 2.5-inch bays with CRPS redundant power. Hot-swap fan access for service without platform downtime.

Applications

Telecom central office and base-station edge compute, GPGPU-accelerated simulation and machine learning at the edge, video analytics in shallow racks, and industrial edge deployments that pair compute with the DS25224 JBOD for expanded storage.

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