Specifications
Form Factor
2U rackmount, 450 mm short depth
Chassis Variants
RM25206 MIO FIO (front I/O); RM25204 MIO RIO (rear I/O)
GPGPU Support
Up to 2 full-height server GPGPU cards
Riser Interface
PCIe Gen5 riser card, up to 32 GT/s
Riser Design
Patented layout stacks the second full-height card horizontally beside the first
Alternative Slot Layout
1 full-height + 6 low-profile expansion slots
Storage — RM25206 MIO FIO
6 x 2.5-inch SAS/SATA, or 2 x NVMe + 4 x SAS/SATA
Storage — RM25204 MIO RIO
Front 2 x NVMe + 2 x SAS/SATA; rear 2 x SAS/SATA
NVMe Support
PCIe Gen4 NVMe drives, up to 16 GT/s
Motherboard Support
E-ATX, CEB and ATX; SSI EEB
Slot Motherboards
Mechanics accommodate both 6.5-slot and mainstream 7-slot boards
CPU Platform
Dual-socket server motherboards
Cooling
Hot-swap fan modules in 8025, 8038 and 8056 sizes
Backplane Options
Multiple HDD backplane solutions across SAS/SATA and NVMe Gen4
Companion Expansion
DS25224 2U short-depth JBOD; RM352 3U edge chassis
Target Segments
Smart surveillance, smart factory and smart city edge deployments
Reference Motherboards
Covered by Chenbro's reference motherboard compatibility program
Overview
The Chenbro RM252 MIO Series is a 2U rackmount chassis built around a single engineering constraint: fit real AI compute into 450 mm of depth. Edge and telco cabinets are rarely deep enough for standard 700 mm-class platforms, so the RM252 uses a patented riser layout that mounts a second full-height GPGPU card horizontally beside the first, letting two accelerator cards occupy a chassis that would normally hold one.
Two variants cover opposite cabling realities. The RM25206 MIO FIO concentrates all connectivity at the front for cold-aisle service; the RM25204 MIO RIO puts I/O at the rear for conventional rack layouts and additionally accepts consumer-grade GPUs for image processing as well as server GPGPUs.
Storage is modular rather than fixed. Backplanes span SAS/SATA through PCIe Gen4 NVMe, the RM25206 offers a six-drive 2.5-inch array or a mixed 2 NVMe + 4 SAS/SATA split, and the RM25204 adds rear drive positions. Cooling is handled by hot-swap fan modules in 8025, 8038 and 8056 form factors so thermal headroom can be retuned as the configuration changes.
For deployments that outgrow a single chassis, the RM252 pairs with the DS25224 2U short-depth JBOD for storage expansion and with the RM352 3U chassis where a third unit of vertical space is available.
Key Benefits
Ultra-short 450 mm depth fits shallow edge, telco and wall-mount racks. Two full-height GPGPUs in 2U through a PCIe Gen5 riser at up to 32 GT/s. Modular MIO architecture lets one chassis serve front-I/O and rear-I/O deployments. Flexible storage from SAS/SATA to PCIe Gen4 NVMe with no change to the chassis frame. Hot-swap cooling across three fan module sizes for configurable thermal headroom.
Applications
Video surveillance analytics, smart-city camera aggregation, smart-factory machine vision at the edge, retail visual detection, distributed inference nodes in space-constrained racks, and telco/edge cabinets where chassis depth is the binding constraint.
Request a Quote — CHENBRO RM252 MIO SERIES — 2U SHORT-DEPTH EDGE AI SERVER CHASSIS
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