Specifications
Model
XIMEA MU003TG-SY-UC
Type
Miniature industrial Time-of-Flight (ToF) camera
Sensor
Sony IMX556 CMOS ToF sensor, global shutter, no on-sensor filter
Resolution
0.3 MP - 640 x 480; 6.4 x 4.8 mm active area
Frame Rate
60 FPS transport limit
Phase Readout
1, 2 or 4 ToF phases; 60 / 120 / 240 phases per second
Binning
1x, 2x2 and 4x4 (640x480, 320x240, 160x120)
Host Interface
USB 3.2 Gen 1 (5 Gbps) via 14-position I-PEX Cabline SS micro-coaxial receptacle
Illumination Interface
10-position I-PEX Cabline V (5V power, high-speed LVDS switching, I2C telemetry)
Illumination Required
External VCSEL source and optical band-pass filter are not included
Lens Mount
C-mount standard (pre-mounted); S-mount optional, reducing depth to 23.67 mm
Enclosure
26.4 x 26.4 x 28.67 mm
Weight
31 g
Digital I/O
2x non-isolated digital inputs/outputs (3.3V logic) and 2x digital outputs
Power Consumption
Approximately 0.45 A
Typical Uses
Embedded vision, robotics, UAVs, kiosks, 3D scanning, face recognition
Overview
The XIMEA MU003TG-SY-UC is a miniature industrial Time-of-Flight camera built around the 0.3MP Sony IMX556 CMOS sensor. The sensor uses a global shutter and carries no on-sensor optical filter, which leaves depth-sensing performance in the hands of the integrator's chosen illumination and band-pass filter rather than the camera module.
At 26.4 x 26.4 x 28.67 mm and 31 grams, the housing is sized for space-constrained embedded vision systems - robotics end-effectors, UAVs, kiosks and 3D scanning rigs. Data, power and control run over USB 3.2 Gen 1 (5 Gbps) through a 14-position I-PEX Cabline SS micro-coaxial connector, and a separate 10-position Cabline V connector provides 5V power, high-speed LVDS switching and I2C telemetry to synchronise an external VCSEL illuminator.
Imaging options are configurable rather than fixed: readout supports 1, 2 or 4 ToF phases (60, 120 or 240 phases per second) against a 60 FPS transport ceiling, with 1x, 2x2 and 4x4 binning producing 640x480, 320x240 or 160x120 output. The camera ships with a C-mount lens; an optional S-mount reduces total depth to 23.67 mm, and two non-isolated digital I/O plus two digital outputs are available for triggering external illumination.
Key Benefits
Global-shutter Sony IMX556 ToF sensing, configurable 1/2/4-phase readout with binning, miniature 31 g housing for embedded platforms, and hardware synchronisation to external VCSEL illumination.
Applications
Robotics and AMR depth sensing, UAV obstacle detection, 3D scanning and metrology, kiosk and interactive display gesture capture, and face recognition at the edge.
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