Specifications

Model

a2A5328-4gmPRO

Camera Series

Basler ace 2 (ace 2 R Pro product line)

Camera Category

Area scan

Sensor

Sony IMX540

Shutter

Global shutter

Resolution

5328 × 4608 px

Frame Rate

4 fps

Pixel Size

2.74 µm × 2.74 µm

Optical Format

1.2"

Mono/Colour

Mono

Interface

GigE (Gigabit Ethernet)

Data Standard

GigE Vision 2.0, GenICam

Housing

Box

Protection Class

IP30

Housing Size

55.5 mm × 29 mm × 29 mm

Lens Mount

C-mount

Operating Temperature

-10 °C to 60 °C

Features

Compression Beyond, Pixel Beyond, PGI image optimisation

Conformity

CE (incl. RoHS), EAC, FCC, KC, UKCA, UL

Warranty

36 months

Overview

The Basler a2A5328-4gmPRO is an ace 2 R Pro GigE area-scan camera built on the Sony IMX540 global shutter CMOS sensor, delivering 5328 × 4608 pixels at 4 fps with 2.74 µm × 2.74 µm pixels over a 1.2" optical format. It is a colour-free industrial camera aimed at inspection and measurement tasks where resolution and geometric accuracy matter more than frame rate.

The ace 2 R Pro line adds Basler's 'Beyond' feature set on top of the base camera: Compression Beyond reduces data volume over the GigE link, Pixel Beyond allows spatial resolution to be traded against sensitivity in-camera, and PGI provides colour and image optimisation. Those features matter in GigE deployments, where a 1000BASE-T link is the hard bandwidth ceiling - the camera gets more usable information through the same cable.

The 55.5 mm × 29 mm × 29 mm IP30 box with a C-mount and a -10 °C to +60 °C operating range is the industry-standard ace 2 mechanical envelope, so it drops into existing ace or ace 2 fixturing without redesign.

Key Benefits

Sony IMX540 global shutter — distortion-free capture of moving parts. 5328 × 4608 resolution — fine-detail inspection over a standard field of view. Compression Beyond / Pixel Beyond / PGI — more usable data over a 1 Gbit link. Standard ace 2 body — 29 mm box and C-mount drop into existing fixtures.

Applications

Automated optical inspection, electronics and PCB assembly verification, semiconductor and component metrology, pharmaceutical and food inspection, robotics guidance, and any GigE-based line where a global-shutter high-resolution sensor is required.

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