Specifications
Product
Iceotope KUL BOX edge thermal routing cabinet
Enclosure
24U self-contained liquid-cooled rack chassis
Server Support
Up to 4 × Dell XE7740 or 6 × HPE DL380 Gen11 servers
Cooling Method
Precision liquid cooling - sealed dielectric, direct-to-everything
Cooled Components
Processors, memory, storage, NICs and power supplies
Heat Rejection
Integrated liquid-to-air cooler
Fan Requirement
None - fan-less server cooling
Acoustics
Under 40 dB (quiet-library class)
Cooling Energy Saving
Up to 83 % reduction versus air-cooled servers
Water Use Reduction
Up to 96 % versus air-cooled, no evaporative loss
Thermal Capability
Demonstrated single-phase cooling of a 1500 W test vehicle
Fluid
Environmentally-safe dielectric, single-phase
Reliability Benefit
Sealed enclosure excludes contaminants and vibration
Deployment
Edge sites, comms closets, standard data halls
Related Products
KUL RAN, KUL Machine, precision liquid cooling IP licensing for OEM/ODM
Manufacturer
Iceotope Technologies
Application Class
Edge AI, HPC, telco/RAN, high-density GPU compute
Lifecycle
Production / deployed
Overview
Iceotope's KUL BOX is a 24U thermal routing cabinet that seals servers in a dielectric fluid loop and rejects the heat through an integrated liquid-to-air cooler. It is the deployment vehicle for Iceotope's precision liquid cooling — a “direct-to-everything” approach in which the coolant passes an internal manifold that runs past every hot component: processors, memory, storage and power supplies, not just the CPU and GPU.
The practical consequence is a fan-less server. With no fans there is no airflow-driven dust ingress and no acoustic signature, so the KUL BOX measures under 40 dB — normal-conversation level. That and the sealed design are what let a 24U cabinet with up to four Dell XE7740 or six HPE DL380 Gen11 nodes sit in an edge site, a comms closet or an office-adjacent data room that would never permit a conventional air-cooled rack at that density.
Efficiency comes from removing the air-handling overhead: Iceotope claims up to 83 % lower cooling energy and up to 96 % less water use than air-cooled servers, because there is no evaporative loss and no CRAH/CRAC fan energy to pay for. In lab validation the same technology cooled a 1500 W thermal test vehicle, well past the 400 W ceiling conventionally associated with single-phase cooling, which is what makes it viable for current-generation accelerators. Iceotope also licenses the cooling IP to OEMs and ODMs building next-generation AI hardware.
Key Benefits
Fan-less, sealed chassis removes dust ingress, fan failures and acoustic limits. Under 40 dB allows deployment in noise-restricted edge and office-adjacent sites. Up to 83 % lower cooling energy and 96 % less water versus air cooling. Cools every component — CPU, GPU, memory, storage and PSU — not just the sockets. 1,500 W single-phase capability covers current high-TDP accelerators. Standard server support (Dell XE7740, HPE DL380 Gen11) avoids proprietary compute.
Applications
Edge AI inference sites and metro data rooms; telco and RAN deployments; high-density GPU compute in noise-restricted buildings; HPC clusters with water-scarcity constraints; research and university compute; colocation cabinets needing above-air-cooling density without facility water.
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