Specifications
Product Line
ThermiQ Edge AI Cooling Solutions (Connect Tech Inc., Guelph, Canada)
Flagship Active Part
XHG332 Active Thermals for NVIDIA Jetson Thor T5000 — 300 W+ sustained
Ambient Rating
XHG332 operates in environments up to 60 C ambient
Orin Active Part
XHG325 Active Thermals for NVIDIA Jetson Orin NX / Orin Nano
SoC Thermal Target
Orin NX / Nano designed against a maximum SoC operating temperature of 99 C
Cooling Options
Active (fan-assisted), Passive (fanless rugged heatsink), Liquid Cooling and Cold Plate
Passive Design
Fanless rugged heatsink for high-reliability sites where moving parts are not acceptable
Liquid Cooling
High-capacity loop for extreme power density and severely constrained airflow enclosures
Cold Plate
Direct-contact conduction interface for fully sealed, IP-rated enclosures
Jetson Coverage
Available across the NVIDIA Jetson family — Thor, AGX Orin, Orin NX / Nano and earlier modules
Purchase Model
Sold standalone, singularly or in bulk — no Connect Tech carrier board or full system required
Engineering Basis
Designs account for Jetson power envelopes, enclosure constraints, airflow limits, fin geometry and mounting strategy
Design Intent
Sustained clocks under continuous AI load, not short benchmark bursts
Qualification
Validated across thousands of deployed systems in robotics, automation, transportation and defence
Jetson Partnership
Connect Tech has designed Jetson thermal solutions since the TX1 generation (2015)
Volume Supply
Bulk purchasing for OEMs, integrators and development teams via Connect Tech sales
Overview
Most thermal hardware sold into AI projects is adapted from either the industrial PC catalogue or the data-centre catalogue. Connect Tech's argument with ThermiQ is that neither fits: an edge AI module is asked to hold sustained clocks inside a sealed or tightly packed enclosure, at elevated ambient temperature, while absorbing shock and vibration. A heatsink specified for a rack server never sees those conditions.
ThermiQ is therefore positioned as a standalone brand rather than an accessory to Connect Tech carrier boards. The parts ship individually or in bulk, with no requirement to buy a baseboard or a complete system, so a team designing its own carrier can still start from a production-qualified thermal design. Four families cover the range of deployment realities: active fan-assisted cooling for compact high-duty-cycle boxes, passive fanless heatsinks for sites where moving parts are banned, liquid cooling for extreme power density with little airflow, and cold plate interfaces for fully sealed conduction-cooled enclosures.
The current leading part is the XHG332, an active thermal solution for the NVIDIA Jetson Thor T5000 rated for 300 W-and-above sustained dissipation and specified to operate in environments up to 60 C ambient. The XHG325 covers Jetson Orin NX and Orin Nano against a 99 C maximum SoC operating temperature. The line is available across the Jetson family, and QS Compute supplies it for robotics, industrial automation, transportation and rugged deployments — contact us for part numbers, form factor drawings and volume lead times.
Key Benefits
Built for sustained load. Aligned to Jetson power modes and operating envelopes rather than benchmark bursts. No carrier lock-in. Standalone parts, sold singularly or in bulk, usable with your own baseboard. Four thermal strategies. Active, passive, liquid and cold-plate options from one qualified vendor.
Applications
Fanless and sealed edge AI enclosures, humanoid and mobile robotics, industrial automation cabinets with poor airflow, transportation and rail computing, defence and aerospace thermal management, and prototype-to-production scaling where a validated thermal design shortens qualification.
Request a Quote — CONNECT TECH THERMIQ — THERMAL MANAGEMENT FOR NVIDIA JETSON EDGE AI
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