MPN: TCS-CP-LGA7529
Cold Plate LGA7529
<0.03 K/W · LGA7529 · Cu

Copper micro-channel cold plate for Intel Granite Rapids LGA7529 processors. Features 0.15mm fin pitch, <0.03 K/W thermal resistance, nickel-plated copper construction, and G1/4 threaded ports. Optimized for 500W+ TDP server CPUs in direct-to-chip liquid cooling loops.

Specifications

Socket

Intel LGA7529

Material

Nickel-plated Copper

Fin Pitch

0.15mm

Thermal Resistance

<0.03 K/W

Max TDP

500W+

Port Thread

G1/4

Dimensions

78 x 112 x 18mm

Weight

380g

Compatibility

Granite Rapids Xeon 6

Use Case

This cold plate targets Intel Granite Rapids processors in AI inference servers where 500W+ TDPs exceed air cooling limits. With <0.03 K/W thermal resistance, a single D5 pump loop can keep a 500W CPU at 65C junction with 35C coolant — enabling sustained AVX-512 vector throughput for recommendation model serving without thermal throttling.

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