MPN: QS-LCP-LGA4677-CU
LGA 4677 Direct-to-Chip Cold Plate
≥500 W

Copper Micro-Fin · G1/4 Ports · LGA 4677 Socket · Server-Grade

Specifications

Socket

LGA 4677

Material

Copper (C1100)

Fin Type

Micro-skived

Ports

G1/4 x2

Thermal Capacity

≥500 W

Flow Rate

0.5-2.0 L/min

Height

20 mm (1U compat.)

Compatibility

Xeon SP / EPYC 9004

Stock

IN STOCK

Price

Quote

Overview

QS Compute LGA 4677 direct-to-chip liquid cooling cold plate. Copper micro-fin cold plate for Intel Xeon Scalable and AMD EPYC 9004 series. ≥500W thermal capacity. G1/4 threaded ports. Optimized for 1U/2U server chassis. Includes thermal paste and mounting kit.

Need LGA 4677 Direct-to-Chip Cold Plate?

LGA 4677 cold plates in stock. Designed for 1U density. OEM volumes available. Custom designs on request.

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