Specifications
Product
Magnum E2
Type
High-speed memory test system (ATE)
Interfaces covered
LPDDR6, DDR6, GDDR7, NAND flash
Architecture
Near-DUT Test (NDT)
Predecessor platform
Magnum EPIC
Configurations
Production and engineering
Coverage
Qualification through high-volume manufacturing
Signalling
High-speed wide-I/O with PAM3
Hardware/software
Common across production and engineering configs
Announced
September 2026
Vendor
Teradyne, Inc. (NASDAQ: TER)
Target
AI data center / HPC memory
Value
Lower test cost as memory moves to higher speed grades
Overview
Teradyne's Magnum E2 is a next-generation high-speed memory test system for advanced DRAM and flash interfaces including LPDDR6, DDR6, GDDR7 and NAND flash. It is built on Teradyne's proven Near-DUT Test (NDT) architecture, the foundation of the widely deployed Magnum EPIC platform.
Magnum E2 supports both production and engineering configurations on common hardware and software, covering qualification through high-volume manufacturing, and addresses PAM3 signalling and wide-I/O devices driven by AI data centers and HPC.
Key Benefits
One platform from qualification to HVM, Near-DUT Test architecture proven on Magnum EPIC, and next-generation interface coverage (LPDDR6 / DDR6 / GDDR7 / NAND) for AI-era memory.
Applications
DRAM and flash device test, memory qualification and characterisation, high-volume manufacturing test, and AI-accelerator memory validation.
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