Specifications
MPN
MTFDKBZ3T8TFR
Order Code (non-SED)
MTFDKBZ3T8TFR-1BC1ZABYY
Order Code (TCG Opal)
MTFDKBZ3T8TFR-1BC15ABYY
Capacity
3.84 TB
Form Factor
E1.S 5.9 mm
Interface
PCIe 4.0 x4 / NVMe
Sequential Read
up to 6,800 MB/s
Sequential Write
up to 5,000 MB/s
Endurance
1 DWPD (5 years, read intensive)
NAND
Micron 176-layer 3D TLC
Sibling SKUs
MTFDKBZ = E1.S 5.9 mm · MTFDKCE = E1.S 15 mm · MTFDKBA = M.2 22x80 · MTFDKCC = U.3 15 mm
Class
Data center read-intensive / boot
Use Case
High-density server bays, EDSFF sleds
Micron 7450 PRO 3.84TB alternatives
| MPN | Form Factor | Interface | Capacity |
|---|---|---|---|
| MTFDKBZ3T8TFR | E1.S 5.9 mm | PCIe 4.0 | 3.84 TB |
| MTFDKBZ1T9TFR | E1.S 5.9 mm | PCIe 4.0 | 1.92 TB |
| MTFDKCE3T8TFR | E1.S 15 mm | PCIe 4.0 | 3.84 TB |
| MTFDKCC3T8TFR | U.3 15 mm | PCIe 4.0 | 3.84 TB |
Use Case
The 3.84 TB E1.S 5.9 mm device is the mid-capacity point of the 7450 PRO EDSFF range. E1.S is 31.5 mm wide and 5.9 mm high, so roughly double the drives fit the same front-panel area as U.2 while the sled itself disappears — which is why current hyperscale-class 1U and 2U platforms are designed around it.
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