Specifications
Module families
TE0808 (UltraSOM+ MPSoC), TE0820 (Zynq UltraScale+ MPSoC)
Device options
ZU2CG, ZU2EG, ZU6EG, ZU9EG, ZU15EG
Memory (TE0808)
4 GB DDR4 SDRAM
Memory (TE0820)
2 GB DDR4 SDRAM, 4 x 5 cm form factor
REV05 / REV06 variants
TE0808-05-… (ZU6EG / ZU9EG / ZU15EG) and TE0808-06-… production revisions
Example MPNs
TE0808-05-BBE81-EK, TE0808-05-9BE81-E, TE0808-05-6BE81-EK, TE0808-05-9GI81-E (industrial), TE0808-06-BBE51-EK, TE0820-05-2AI51MA, TE0820-05-2BE51QA
System Logic Cells (ZU15EG)
747 K
Total RAM (ZU15EG)
69 Mb
DSP Slices (ZU15EG)
3,528
16.3 Gb/s Transceivers
24 (ZU15EG)
PCI Express (ZU15EG)
2x Gen3 x16 and 1x Gen3 x8, or 4x Gen3 x8
Maximum I/O Pins
328 (ZU15EG)
Application Processing Unit
Quad-core Arm Cortex-A53 MPCore up to 1.5 GHz
Real-time Processing Unit
Dual-core Arm Cortex-R5F MPCore up to 600 MHz
Graphics Processing Unit
Arm Mali-400 MP2 up to 667 MHz
Dynamic Memory Interface
DDR4, LPDDR4, DDR3, DDR3L, LPDDR3
High-Speed Peripherals
PCIe Gen2, USB 3.0, SATA 3.1, DisplayPort, Gigabit Ethernet (device-level)
Baseboard
TEBF0808-05 UltraITX+ baseboard for TE080X UltraSOM+ modules
Cooling
Module heat spreaders and spring-mounted heatsinks available (KK0808-05)
Toolchain
AMD Vivado / Vitis unified software platform
Price
Quote upon request
Availability
Available
Overview
Trenz Electronic's UltraSOM+ range packages AMD Zynq UltraScale+ MPSoC devices as solderable system-on-modules that require only a carrier board to form a complete embedded computer. The TE0808 family carries the larger devices — ZU6EG, ZU9EG and ZU15EG — with 4 GB of DDR4 SDRAM, while the TE0820 brings ZU2CG and ZU2EG devices into a 4 x 5 cm module with 2 GB of DDR4.
At the top of the family the ZU15EG provides 747 K system logic cells, 69 Mb of total RAM, 3,528 DSP slices and 24 transceivers running at 16.3 Gb/s, with PCIe Gen3 support configured as two x16 links plus one x8, or four x8 links. The on-die processing system adds a quad-core Arm Cortex-A53 cluster at up to 1.5 GHz, dual Cortex-R5F real-time cores at up to 600 MHz, an Arm Mali-400 MP2 GPU and a memory controller covering DDR4, LPDDR4, DDR3, DDR3L and LPDDR3.
The modules are offered across production revisions — REV05 and REV06 for the TE0808 — and in commercial and industrial temperature grades, evidenced by part numbers such as TE0808-05-9GI81-E with the -2I industrial device. Trenz supplies the TEBF0808-05 UltraITX+ baseboard as the reference carrier, along with spring-mounted heatsinks and heat spreaders sized to the module.
This family is typically designed into vision controllers, industrial gateways, software-defined radio front-ends and robotics platforms where the combination of an ARM application processor, real-time cores and programmable logic in one package removes the need for a separate FPGA and CPU.
QS Compute supplies Trenz UltraSOM+ modules and accessories with quote-based pricing, alongside the corresponding AMD Zynq UltraScale+ device pages and the wider industrial SoM catalogue.
Key Benefits
Single-module CPU + FPGA + real-time processing from ZU2CG to ZU15EG. 747 K logic cells and 24x 16.3 Gb/s transceivers at the top of the range. Reference UltraITX+ carrier (TEBF0808-05) available. Commercial and industrial temperature grades. AMD Vivado / Vitis toolchain with Trenz board support.
Applications
Industrial vision controllers; software-defined radio and radar front-ends; robotics motion and perception platforms; industrial IoT gateways with FPGA pre-processing; medical imaging modules; aerospace and defence embedded computing.
Request a Quote — TRENZ TE0808 ULTRASOM+ ZYNQ ULTRASCALE+ MPSOC MODULES — ZU6EG TO ZU15EG
QS Compute — global B2B supply of AI computing hardware, edge AI systems and accelerators. Volume pricing, 15-day sample lead time.
Get Your Quote →