Trenz Electronic Kintex FPGA Modules — TE0841 UltraScale and TE0741 Kintex-7

Specifications

Overview

Trenz Electronic covers the middle of the AMD FPGA range with two 4 x 5 cm micro module families. The TE0841 uses Kintex UltraScale KU035 and KU040 devices with 2 GB of DDR4 SDRAM, and the TE0741 uses Kintex-7 XC7K160T, XC7K325T and XC7K410T devices with 32 MB of QSPI configuration flash on the module.

For reference, the Kintex-7 K410T device used on the top TE0741 variant provides 406,720 logic cells, 1,540 DSP slices, 28,620 Kb of block RAM and 24 GTX transceivers running at up to 12.5 Gb/s, with DDR3 memory support up to 1,866 Mb/s. Moving up to the Kintex UltraScale generation on the TE0841 raises the memory interface to DDR4/DDR3 at up to 2,400 Mb/s and lifts transceiver rates to 16.3 Gb/s at the family level.

Both families are intended for design-in rather than standalone use: they need a Trenz carrier or a custom baseboard, and Trenz stocks the matching accessories — spring-mounted heatsinks for the TE0841, module heat spreaders, and PCIe/FMC carriers for FPGA-based processing cards.

Typical applications are industrial image processing, multi-channel data acquisition, motor and motion control loops, protocol bridging and hardware-accelerated pre-processing in front of a host CPU. The Kintex devices trade the higher logic density of Virtex for cost and power, which is why they remain the default choice for mid-range industrial FPGA modules.

QS Compute supplies the Trenz Kintex module families with quote-based pricing and can bundle the corresponding carrier boards and thermal hardware.

Key Benefits

Two device generations — Kintex UltraScale KU035/KU040 and Kintex-7 K160T/K325T/K410T. 2 GB DDR4 on TE0841 and 32 MB QSPI flash on TE0741. 4 x 5 cm common footprint across the family. Low-profile variant available (TE0841-03-41I31-L). Matched carrier boards, heatsinks and FMC carriers from the same vendor.

Applications

Industrial machine vision and image processing; multi-channel data acquisition; motion and motor control; protocol and bus bridging; hardware pre-processing ahead of host CPUs; test and measurement instrumentation.

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