Specifications
Processor
Qualcomm Dragonwing IQ-2390 industrial edge AI SoC
CPU
Quad-core Qualcomm Kryo
GPU
Qualcomm Adreno 704 with 3D graphics
NPU
1.1 TOPS NPU for on-device inference
Real-Time Core
Integrated RISC-V microcontroller
Vision Pipeline
Integrated ISP with local vision processing
Form Factor
47 x 114 mm board-level SBC
Memory
2 GB or 4 GB RAM
Storage
16 GB eMMC
Networking
Dual Gigabit Ethernet with Time-Sensitive Networking (TSN)
Serial Interfaces
RS232 and RS485
Fieldbus
CAN bus
USB
USB-C
Wireless
Wi-Fi and Bluetooth
Expansion Connector
Camera, audio, Ethernet, USB and I2C/I3C signal breakout
Power Input
9 V to 24 V DC
Operating System
Clea OS 2.0, Yocto-Linux based; Clea OS 3.0 planned
Security
Secure Boot, OTA updates, remote device management, Docker-based application management
Processor Thermal Grade
-30 °C to +115 °C with shock and vibration hardening
Design Intent
Board-level platform for OEM-defined enclosures and peripheral configuration
Availability
SECO Early Access Program; Qualcomm evaluation kits expected early 2027
Overview
The SECO SBC-Dragonwing-IQ-2390 is the board-level counterpart to SECO's Compact Vision 5 panel PC. Both carry the Qualcomm Dragonwing IQ-2390 — the first device in Qualcomm's industrial IQ2 Series — but the SBC delivers the same compute, memory and connectivity foundation in a 47 x 114 mm form factor with no display or enclosure, leaving the mechanical design to the OEM.
That trade-off is the point of the board. Integrators who already have a sealed, DIN-rail, ATEX-style or custom housing can add edge AI without accepting a vendor's panel dimensions, and the expansion connector breaks out camera, audio, Ethernet, USB and I2C/I3C signalling so peripheral choice stays open.
Compute is identical to the panel variant: a quad-core Kryo CPU, Adreno 704 GPU, a 1.1 TOPS NPU, an integrated ISP for vision, an audio DSP and a real-time RISC-V microcontroller, all hardened for -30 °C to +115 °C operation with shock and vibration tolerance. On-board memory is 2 GB or 4 GB RAM with 16 GB eMMC.
Industrial I/O covers dual Gigabit Ethernet with Time-Sensitive Networking, RS232, RS485, CAN and USB-C, with Wi-Fi and Bluetooth for wireless backhaul. The whole board runs SECO's Clea OS 2.0 Yocto-Linux distribution with Secure Boot, OTA updates, remote device management and Docker support.
Key Benefits
47 x 114 mm board-level form factor for OEM-defined enclosures. 1.1 TOPS NPU plus integrated ISP for local vision inference. Dual GbE with TSN for deterministic industrial networking. Camera, audio and I2C/I3C expansion so peripherals are not fixed by the vendor. Same Clea OS stack as SECO's panel and SoM products for one software baseline.
Applications
Custom industrial controllers, OEM-designed gateways, operator interfaces built into third-party housings, machine-vision front ends, energy and building-automation nodes, and reference designs for edge AI products that must ship in a customer-specified enclosure.
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