Specifications

EXMP-Q911 module

COM-HPC Mini module (PICMG specification)

EXMP-Q911 SoC

Qualcomm Dragonwing IQ9 Series (IQ-9075)

EXMP-Q911 AI

Up to 100 TOPS dense via dual NPU

EXMP-Q911 memory

36 GB LPDDR5X onboard

EXMP-Q911 storage

128 GB UFS 3.1

EXMP-Q911 expansion

PCIe Gen4, USB 3.2, dual 2.5GbE LAN, dual DP1.2, MIPI CSI-2, CAN FD

EXMP-Q911 temperature

-40 C to +85 C wide-temperature operation

EXMR-QA01 module

Built on Qualcomm Dragonwing IQ10 Series

EXMR-QA01 AI

Up to 350 TOPS dense

EXMR-QA01 CPU

18-core Qualcomm Oryon CPU

EXMR-QA01 cameras

Supports up to 20 MIPI cameras at 16 MP

EXMR-QA01 safety

Integrated Safety Island (SAIL) module

EXEC-Q911 kit

EXEC-Q911 starter kit for Dragonwing IQ9 development

APEX-A100 system

Fanless edge AI system for Dragonwing IQ9 Series

Video throughput

1080p at 29 fps across 9 channels; 720p at 5 fps across 32 channels

Benchmark reference

10 concurrent 1080p video streams at 30W using YOLOv10n

Camera options

MIPI CSI-2 modules at 2 MP, 8 MP and 13 MP with HDR and external trigger

GMSL camera options

13 MP fixed focus, 3 MP fixed focus with HDR LFM, 2 MP fixed focus with HDR

Industrial I/O modules

10GbE LAN, serial communication, CAN Bus and CAN FD modules

Storage and memory

NVMe SSDs and DRAM modules validated for the platform

Supply longevity

Qualcomm Dragonwing longevity support through 2038

Software enablement

Qualcomm AI Hub with 250+ optimized models, YOLOv10-class detection support

Overview

Innodisk's AI on Dragonwing portfolio turns Qualcomm's industrial edge AI silicon into deployment-ready hardware: modules, starter kits and finished systems, all pre-validated with Innodisk driver porting and peripheral integration so integrators are not porting a board support package from scratch.

The flagship EXMP-Q911 is a COM-HPC Mini module carrying the Qualcomm Dragonwing IQ9 Series (IQ-9075) processor and delivering up to 100 TOPS via a dual NPU, with 36 GB of LPDDR5X, 128 GB of UFS 3.1, PCIe Gen4, dual 2.5GbE and CAN FD — all rated for -40 C to +85 C. The newer EXMR-QA01 extends the line to the Dragonwing IQ10 Series with up to 350 TOPS dense, an 18-core Qualcomm Oryon CPU, support for up to 20 MIPI cameras at 16 MP, and an integrated Safety Island (SAIL) module for heavy-duty AMR, humanoid robotics and VLM/VLA workloads.

Around those modules Innodisk supplies the EXEC-Q911 starter kit, a fanless edge AI system in the APEX-A100, and a pre-validated accessory stack: MIPI and GMSL camera modules with ported drivers for vision and VLM pipelines, plus M.2 expansion for networking, storage and industrial I/O including 10GbE, serial, CAN Bus and CAN FD. Published testing shows 10 concurrent 1080p video streams at 30 W on YOLOv10n. Qualcomm's Dragonwing longevity program covers these parts through 2038.

Key Benefits

Deployment-ready Dragonwing hardware — modules, starter kits, fanless systems and pre-validated camera and I/O accessories with ported drivers. Scalable AI from 100 TOPS on the EXMP-Q911 (IQ9) to 350 TOPS on the EXMR-QA01 (IQ10), with -40 C to +85 C operation and Qualcomm longevity support through 2038.

Applications

Multi-channel video inferencing and industrial inspection, AMR and AGV navigation, humanoid and industrial robotics, VLM and VLA edge workloads, smart city and transport analytics, and factory automation defect detection.

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