Mobilint REGULUS MLM-1 SoM — 10 TOPS AI System-on-Module, 55 x 50 mm

Specifications

Overview

The MLM-1 is a 55 x 50 mm system-on-module built on the REGULUS AI SoC. It integrates the NPU, a quad-core Arm Cortex-A53 cluster with a Cortex-M0+ companion core, an ISP, a video codec, memory and storage on a single board, delivering 10 TOPS of INT8 inference from a 3 W thermal design power and a 5 V input.

The module exposes its interfaces through three 100-pin board-to-board connectors carrying dual MIPI CSI2 camera receivers, a MIPI CSI2 transmitter plus MIPI DSI for display, Gigabit Ethernet with RJ45, USB 3.1 Type-A and Type-C, UART, I2S audio with speaker output and microphone input, and a 12-pin JTAG debug header. The integrated codec handles HEVC, H.264 and MJPEG up to 4K at 60 fps.

Mobilint's design-in model is to develop and validate on the REGULUS AI EVK carrier board, then design a custom carrier for the target product. The compute module, software stack and compiled models carry over with no changes, which shortens the path from prototype to production hardware.

For industrial AI products where an off-the-shelf box is too large or too power-hungry, the MLM-1 provides the compute, camera and display interfaces needed to build a compact instrument around a 3 W AI engine.

Key Benefits

10 TOPS at 3 W from a 55 x 50 mm module. Dual MIPI CSI2 camera inputs plus display output on-module. 4K @ 60 fps hardware codec. Direct path from EVK to custom carrier with no software re-integration. One SoC handles camera, vision and language.

Applications

Compact machine-vision cameras and smart sensors; industrial instruments and analysers; robotics perception modules; medical imaging front-ends; intelligent displays and HMIs; automotive and transport vision systems.

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