Specifications
Product
Calixto Systems AM62L STAMP SOM
SoC
Texas Instruments Sitara AM62Lx (single-core / dual-core)
CPU
Arm Cortex-A53 @ 1.25 GHz
Memory
Up to 2 GB LPDDR4 / LPDDR4x
Storage
8 GB or 16 GB eMMC flash
Package
40 × 40 mm with 37 × 4 solderable border pads
Storage Interfaces
2× SD/MMC interfaces
Display
4-lane MIPI DSI or 24-bit parallel RGB (DPI)
Audio
McASP audio interfaces and DAC
Networking
2× Gigabit Ethernet MACs (RGMII)
USB
2× High-Speed USB 2.0 OTG
Security
Security Controller — secure boot, TEE, AES, PKA for RSA/ECC, DRBG, TRNG, UniqueID
PMIC
TI reference PMIC for the AM62L / AM625 family
Temperature Range
Commercial 0 to +70 °C; industrial −40 to +85 °C
Evaluation Kit
AM62L STAMP SOM Evaluation Kit (microSD, MIPI DSI + parallel display connectors, GbE RJ45, USB Type-A + micro USB OTG, RS-485, CAN, mikroBUS)
Overview
The Calixto Systems AM62L STAMP SOM is a 40 × 40 mm system-on-module around the Texas Instruments Sitara AM62Lx processor, in the direct-solderable STAMP form factor — 37 × 4 border pads rather than a connector pair. Direct solder is the right choice where the end product is a fixed design with a long production life, because it removes the cost, height and mechanical-compliance risk of a board-to-board connector.
The module carries a single- or dual-core Cortex-A53 at 1.25 GHz with up to 2 GB of LPDDR4x and 8 or 16 GB of eMMC, two SD/MMC interfaces, two Gigabit Ethernet MACs on RGMII, dual High-Speed USB 2.0 OTG, McASP audio with a DAC, and a display path that is either a 4-lane MIPI DSI or a 24-bit parallel RGB interface. TI's reference PMIC for the AM62L/AM625 family handles the power rails on-module.
The security block is a full TI Security Controller rather than a token secure-boot flag: secure boot, a Trusted Execution Environment, AES, public-key acceleration for RSA and ECC, a DRBG, a hardware TRNG and a UniqueID. There are commercial (0 to +70 °C) and industrial (−40 to +85 °C) versions, and Calixto supplies an evaluation kit that breaks out GbE, USB, RS-485, CAN, microSD, both display connectors and a mikroBUS socket.
Key Benefits
Solderable 40 × 40 mm module. Direct-solder STAMP pads remove connector cost, height and mating tolerances from a fixed industrial design. Full TI Security Controller. Secure boot, TEE, AES, RSA/ECC public-key acceleration, TRNG and UniqueID on-module — ready for authenticated and encrypted industrial endpoints. Two Gigabit MACs and two display paths. Dual RGMII Ethernet plus a choice of 4-lane MIPI DSI or 24-bit parallel RGB suits both new panel designs and legacy RGB panels. Industrial temperature option. −40 to +85 °C alongside the commercial grade.
Applications
Industrial HMI and control panels, EV charging controllers, medical and laboratory instruments, building and energy automation, industrial gateways and protocol converters, secure IoT endpoints, retrofits of parallel-RGB panel designs.
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